EP21FL

硕士邦德聚合物系统EP21FL是低到中等粘度，双组分环氧树脂高性能铸造，粘接，密封，并制定治愈在室温或高温下更迅速，四（4）一（1，涂料树脂体系）按重量比例混合。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它非常适合用于粘接具有不同膨胀系数的不同基材。 作为一个低粘度系统也是非常适合盆栽，涂料​​，密封电子产品。 硕士邦德聚合物系统EP21FL生产高强度和坚韧铸件，债券和海豹是显着的抗热循环和包括水，油和大多数有机溶剂的化学品，在极宽的温度范围 – 60 ° F至250 ° F以上。 硬化化合物是一种电的绝缘体。 部分颜色A是明确的，B部分琥珀。 硕士邦德聚合物系统EP21FL被广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 作为一个flexibilized系统，它的特点是优越的冲击和震撼性。

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is well suited for bonding dissimilar substrates with different coefficients of expansion . As a lower viscosity system it is also well suited for potting, coating, and sealing electronics. Master Bond Polymer System EP21FL produces high strength and tough castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of – 60°F to more than 250°F. The hardened compound is an electrical insulator. Color of part A is clear, part B amber. Master Bond Polymer System EP21FL is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. As a flexibilized system, it is characterized by superior impact and shock resistance.