硕士邦德聚合物系统EP21DP11是一种低粘度，双组分高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，配方，固化的环境温度或在高温下更迅速，方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的空气释放剂。 硕士邦德聚合物系统EP21DF11特别推荐其中的低粘度固化涂料是必需的，或铸件必须承受恶劣的环境下，也暴露在各种化学品和温度循环可达275 ° F。 附着力既相似，不同的衬底是非常好的。 硬化材料是绝缘体。 部分颜色A是红色的，B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛用于电子，电气，计算机，建筑，电器，金属加工，汽车，化工等行业。 该化合物符合MIL – I – 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.

硕士邦德聚合物系统EP21DP11是一种低粘度，双组分高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，配方，固化的环境温度或在高温下更迅速，方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的空气释放剂。 硕士邦德聚合物系统EP21DF11特别推荐其中的低粘度固化涂料是必需的，或铸件必须承受恶劣的环境下，也暴露在各种化学品和温度循环可达275 ° F。 附着力既相似，不同的衬底是非常好的。 硬化材料是绝缘体。 部分颜色A是红色的，B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛用于电子，电气，计算机，建筑，电器，金属加工，汽车，化工等行业。 该化合物符合MIL – I – 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.

硕士邦德聚合物系统EP21DP11是一种低粘度，双组分高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，配方，固化的环境温度或在高温下更迅速，方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的空气释放剂。 硕士邦德聚合物系统EP21DF11特别推荐其中的低粘度固化涂料是必需的，或铸件必须承受恶劣的环境下，也暴露在各种化学品和温度循环可达275 ° F。 附着力既相似，不同的衬底是非常好的。 硬化材料是绝缘体。 部分颜色A是红色的，B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛用于电子，电气，计算机，建筑，电器，金属加工，汽车，化工等行业。 该化合物符合MIL – I – 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.