粘接和密封;功能剥离强度和抗冲击性能高
Bonding and sealing; features high peel strength and shock resistance
技术参数/Specifications
| Compound Type | Encapsulant, Potting Compound; Sealant; Adhesive |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Cure / Technology | Two Component |
| Features | Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21TCDC-4,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21TCDC-4, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21TCDC-4
粘接和密封;功能剥离强度和抗冲击性能高
Bonding and sealing; features high peel strength and shock resistance
技术参数/Specifications
| Compound Type | Encapsulant, Potting Compound; Sealant; Adhesive |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Cure / Technology | Two Component |
| Features | Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21TCDC-4,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21TCDC-4, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21TCDC-4
粘接和密封;功能剥离强度和抗冲击性能高
Bonding and sealing; features high peel strength and shock resistance
技术参数/Specifications
| Compound Type | Encapsulant, Potting Compound; Sealant; Adhesive |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Cure / Technology | Two Component |
| Features | Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21TCDC-4,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21TCDC-4, Master Bond, Inc., Polyurethane Adhesives and Sealants