硕士邦德高分子胶粘剂EP21HTAOTDC是一种二组分导热高性能配方，固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂，以一比一的比例混合，重量或体积。 它易于开发了2800多个在室温下PSI它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 该EP21HTAOTDC环氧树脂体系还具有非常高的剥离强度后，室温固化。 硕士邦德聚合物可应用于胶粘剂EP21HTAOTDC没有下垂或垂直的表面上，甚至滴水。 它产生了极宽的温度范围-60耐用强度高，这是明显的抗热循环和包括水，石油和化学溶剂最艰难的器​​官债券，° F至400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种优良的电绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21HTAOTDC胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21HTAOTDC epoxy resin system furthermore features very high peel strength after room temperature cure. Master Bond Polymer Adhesive EP21HTAOTDC can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organ solvents, over the exceptionally wide temperature range of -60°F to 400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an excellent electrical insulator. Color of part A gray, part B amber. Master Bond EP21HTAOTDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德高分子胶粘剂EP21HTAOTDC是一种二组分导热高性能配方，固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂，以一比一的比例混合，重量或体积。 它易于开发了2800多个在室温下PSI它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 该EP21HTAOTDC环氧树脂体系还具有非常高的剥离强度后，室温固化。 硕士邦德聚合物可应用于胶粘剂EP21HTAOTDC没有下垂或垂直的表面上，甚至滴水。 它产生了极宽的温度范围-60耐用强度高，这是明显的抗热循环和包括水，石油和化学溶剂最艰难的器​​官债券，° F至400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种优良的电绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21HTAOTDC胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21HTAOTDC epoxy resin system furthermore features very high peel strength after room temperature cure. Master Bond Polymer Adhesive EP21HTAOTDC can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organ solvents, over the exceptionally wide temperature range of -60°F to 400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an excellent electrical insulator. Color of part A gray, part B amber. Master Bond EP21HTAOTDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德高分子胶粘剂EP21HTAOTDC是一种二组分导热高性能配方，固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂，以一比一的比例混合，重量或体积。 它易于开发了2800多个在室温下PSI它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 该EP21HTAOTDC环氧树脂体系还具有非常高的剥离强度后，室温固化。 硕士邦德聚合物可应用于胶粘剂EP21HTAOTDC没有下垂或垂直的表面上，甚至滴水。 它产生了极宽的温度范围-60耐用强度高，这是明显的抗热循环和包括水，石油和化学溶剂最艰难的器​​官债券，° F至400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种优良的电绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21HTAOTDC胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21HTAOTDC epoxy resin system furthermore features very high peel strength after room temperature cure. Master Bond Polymer Adhesive EP21HTAOTDC can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organ solvents, over the exceptionally wide temperature range of -60°F to 400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an excellent electrical insulator. Color of part A gray, part B amber. Master Bond EP21HTAOTDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.