EP101M

硕士邦德EP101M是一种单组分快速固化树脂环氧系统，特别是电力和浸渍灌封应用而设计的。 它是一种低粘度，100％活性树脂，不含任何溶剂或其他挥发性物质。 正确盆栽或封装的部分是完全免费的孔隙度和空隙。 主键EP101M系统具有优良的电绝缘特性。 它可以很容易地处理了各种方法，包括铸造，浸渍，浸涂层和层压。 当用于锅sikia砂，固化树脂具有优良的导热性。

Master Bond EP101M is a single component epoxy fast curing resin system especially designed for electrical potting and impregnation applications. It is a low viscosity, 100% reactive resin which does not contain any solvents or other volatiles. Properly potted or encapsulated parts are completely free of porosity and voids. The Master Bond EP101M system has excellent electrical insulation characteristics. It can be readily processed by a variety of methods including casting, impregnation, dip coatings and laminating. When used to pot sikia sand, the cured resin features excellent thermal conductivity.