硕士邦德聚合物系统EP30C是一种新型，多功能的双组分镍改性聚合物系统，具有高导电性，优良的粘接强度和耐化学性的EMI / RFI屏蔽以及粘接和密封应用。 这种化合物独特的高导电电结合，如强度，耐化学性和品质环氧树脂胶粘剂的性能特点和优势的认识还提供了理想的韧性，耐磨性和耐久性。 硕士邦德聚合物配制系统EP30C是在室温下固化或与方便的百对一（100:5）混合的重量比高温更为迅速。 以最小收缩到一个导电，高强度和非常良好的耐热循环和包括水，无机盐，碱和酸类以及在极宽的温度范围内的许多有机化工品坚韧弹性体复合EP30C系统治疗 – 60 ° F至250 ° F.以上 它是100％反应，不含有任何溶剂或稀释剂。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 固化后的导电聚合物具有较高的尺寸稳定性。 硕士邦德聚合物系统EP30C广泛用于EMI / RFI屏蔽以及粘接，密封和封装应用中的高导电性是必需的。

Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound uniquely combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities and also offers desirable toughness, abrasion resistance and durability. Master Bond Polymer System EP30C is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one hundred-to-one (100:5) mix ratio by weight. The EP30C system cures with minimal shrinkage to an electrically conductive, high strength and tough elastomer compound with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. It is 100% reactive and does not contain any solvents or diluents. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured electrically conductive polymer has high dimensional stability. Master Bond Polymer System EP30C is widely used for EMI/RFI shielding as well as bonding, sealing and encapsulation applications where high electrical conductivity is required.

硕士邦德聚合物系统EP30C是一种新型，多功能的双组分镍改性聚合物系统，具有高导电性，优良的粘接强度和耐化学性的EMI / RFI屏蔽以及粘接和密封应用。 这种化合物独特的高导电电结合，如强度，耐化学性和品质环氧树脂胶粘剂的性能特点和优势的认识还提供了理想的韧性，耐磨性和耐久性。 硕士邦德聚合物配制系统EP30C是在室温下固化或与方便的百对一（100:5）混合的重量比高温更为迅速。 以最小收缩到一个导电，高强度和非常良好的耐热循环和包括水，无机盐，碱和酸类以及在极宽的温度范围内的许多有机化工品坚韧弹性体复合EP30C系统治疗 – 60 ° F至250 ° F.以上 它是100％反应，不含有任何溶剂或稀释剂。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 固化后的导电聚合物具有较高的尺寸稳定性。 硕士邦德聚合物系统EP30C广泛用于EMI / RFI屏蔽以及粘接，密封和封装应用中的高导电性是必需的。

Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound uniquely combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities and also offers desirable toughness, abrasion resistance and durability. Master Bond Polymer System EP30C is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one hundred-to-one (100:5) mix ratio by weight. The EP30C system cures with minimal shrinkage to an electrically conductive, high strength and tough elastomer compound with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. It is 100% reactive and does not contain any solvents or diluents. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured electrically conductive polymer has high dimensional stability. Master Bond Polymer System EP30C is widely used for EMI/RFI shielding as well as bonding, sealing and encapsulation applications where high electrical conductivity is required.

硕士邦德聚合物系统EP30C是一种新型，多功能的双组分镍改性聚合物系统，具有高导电性，优良的粘接强度和耐化学性的EMI / RFI屏蔽以及粘接和密封应用。 这种化合物独特的高导电电结合，如强度，耐化学性和品质环氧树脂胶粘剂的性能特点和优势的认识还提供了理想的韧性，耐磨性和耐久性。 硕士邦德聚合物配制系统EP30C是在室温下固化或与方便的百对一（100:5）混合的重量比高温更为迅速。 以最小收缩到一个导电，高强度和非常良好的耐热循环和包括水，无机盐，碱和酸类以及在极宽的温度范围内的许多有机化工品坚韧弹性体复合EP30C系统治疗 – 60 ° F至250 ° F.以上 它是100％反应，不含有任何溶剂或稀释剂。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 固化后的导电聚合物具有较高的尺寸稳定性。 硕士邦德聚合物系统EP30C广泛用于EMI / RFI屏蔽以及粘接，密封和封装应用中的高导电性是必需的。

Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound uniquely combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities and also offers desirable toughness, abrasion resistance and durability. Master Bond Polymer System EP30C is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one hundred-to-one (100:5) mix ratio by weight. The EP30C system cures with minimal shrinkage to an electrically conductive, high strength and tough elastomer compound with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. It is 100% reactive and does not contain any solvents or diluents. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured electrically conductive polymer has high dimensional stability. Master Bond Polymer System EP30C is widely used for EMI/RFI shielding as well as bonding, sealing and encapsulation applications where high electrical conductivity is required.