硕士邦德聚合物系统EP30BN是一种二组分氮化硼高性能环氧粘接，密封，涂料，具有非常高的热导率和优良的电绝缘性能灌封树脂体系。 这种热传导环氧系统的低体重是特别为航空航天和国防应用，以及微电子组件可取的。 这是制定治愈在室温或在高温下更迅速，并已按重量十到一（10:1）的混合比例。 其他吸引人的特性包括出色的尺寸稳定性以及优良的物理强度性能。 EP30BN是一个具有良好的流量特性介质粘度系统，使其成为理想的导热粘接，密封，灌封环氧树脂。 EP30BN也是一个很好的粘接/密封胶形成持久的，僵化的债券能够抵抗热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F温度范围宽，到300 ° F。 的热膨胀系数是刻意低。 该部分的颜色是灰色和一个B部分是明确的。 硕士邦德EP30BN被广泛用于电子，电气，计算机，金属加工，家电，汽车和化学在电气绝缘和环保要求和最大传热必须保持产业。 这种导热环氧化合物，特别是低体重的重量敏感航空航天和国防应用，以及加强散热特性微电子组件吸引力。

Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical insulation properties. The low weight of this thermally conductive epoxy system is particularly desirable for aerospace and defense applications as well as microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional stability as well as superior physical strength properties. EP30BN is a medium viscosity system with good flow characteristics, making it an ideal thermally conductive bonding, sealing and potting epoxy. EP30BN is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 300°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30BN is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and maximum heat transfer must be maintained. The low weight of this thermally conductive epoxy compound is especially attractive for weight sensitive aerospace and defense applications as well as micro-electronic assemblies for enhancing heat dissipation characteristics.

硕士邦德聚合物系统EP30BN是一种二组分氮化硼高性能环氧粘接，密封，涂料，具有非常高的热导率和优良的电绝缘性能灌封树脂体系。 这种热传导环氧系统的低体重是特别为航空航天和国防应用，以及微电子组件可取的。 这是制定治愈在室温或在高温下更迅速，并已按重量十到一（10:1）的混合比例。 其他吸引人的特性包括出色的尺寸稳定性以及优良的物理强度性能。 EP30BN是一个具有良好的流量特性介质粘度系统，使其成为理想的导热粘接，密封，灌封环氧树脂。 EP30BN也是一个很好的粘接/密封胶形成持久的，僵化的债券能够抵抗热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F温度范围宽，到300 ° F。 的热膨胀系数是刻意低。 该部分的颜色是灰色和一个B部分是明确的。 硕士邦德EP30BN被广泛用于电子，电气，计算机，金属加工，家电，汽车和化学在电气绝缘和环保要求和最大传热必须保持产业。 这种导热环氧化合物，特别是低体重的重量敏感航空航天和国防应用，以及加强散热特性微电子组件吸引力。

Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical insulation properties. The low weight of this thermally conductive epoxy system is particularly desirable for aerospace and defense applications as well as microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional stability as well as superior physical strength properties. EP30BN is a medium viscosity system with good flow characteristics, making it an ideal thermally conductive bonding, sealing and potting epoxy. EP30BN is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 300°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30BN is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and maximum heat transfer must be maintained. The low weight of this thermally conductive epoxy compound is especially attractive for weight sensitive aerospace and defense applications as well as micro-electronic assemblies for enhancing heat dissipation characteristics.

硕士邦德聚合物系统EP30BN是一种二组分氮化硼高性能环氧粘接，密封，涂料，具有非常高的热导率和优良的电绝缘性能灌封树脂体系。 这种热传导环氧系统的低体重是特别为航空航天和国防应用，以及微电子组件可取的。 这是制定治愈在室温或在高温下更迅速，并已按重量十到一（10:1）的混合比例。 其他吸引人的特性包括出色的尺寸稳定性以及优良的物理强度性能。 EP30BN是一个具有良好的流量特性介质粘度系统，使其成为理想的导热粘接，密封，灌封环氧树脂。 EP30BN也是一个很好的粘接/密封胶形成持久的，僵化的债券能够抵抗热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F温度范围宽，到300 ° F。 的热膨胀系数是刻意低。 该部分的颜色是灰色和一个B部分是明确的。 硕士邦德EP30BN被广泛用于电子，电气，计算机，金属加工，家电，汽车和化学在电气绝缘和环保要求和最大传热必须保持产业。 这种导热环氧化合物，特别是低体重的重量敏感航空航天和国防应用，以及加强散热特性微电子组件吸引力。

Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical insulation properties. The low weight of this thermally conductive epoxy system is particularly desirable for aerospace and defense applications as well as microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional stability as well as superior physical strength properties. EP30BN is a medium viscosity system with good flow characteristics, making it an ideal thermally conductive bonding, sealing and potting epoxy. EP30BN is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 300°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30BN is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and maximum heat transfer must be maintained. The low weight of this thermally conductive epoxy compound is especially attractive for weight sensitive aerospace and defense applications as well as micro-electronic assemblies for enhancing heat dissipation characteristics.