硕士邦德聚合物系统EP51FL是一个高度灵活的双组份环氧粘接密封和高性能涂料树脂体系。 虽然大多数flexiblilized环氧树脂配方固化速度很慢，EP51FL提供了一个相对快速固化，具有在约30-40分钟，在室温下24小时内完全固化大多数情况下设置时间。 此外，EP51FL将更加迅速固化在高温下。 它具有重量或体积方便一对一混合比例。 固化后的复合呈现出非常高的剥离强度超过25 PLI与大于75％，伸长率相处。 EP51FL将形成包括金属，玻璃，陶瓷，木材，橡胶和各种塑料很多很多不同的衬底灵活，强度高的债券。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP51FL被广泛用于电子，电气，计算机，光学，金属加工，家电，汽车和航空航天行业，在良好的柔韧性和快速固化是可取的属性特征。 EP51FL承受热和机械冲击和具有高超的耐热循环。 此外，EP51FL已用于低温应用，既是胶粘剂和密封剂。 它的工作温度范围是4K到250 ° F。 一个名为EP51FLND糊版时也可用“非滴灌”系统是必需的。 此外，EP51FL将在较低温度下固化，在20 ° F低，虽然会在室温下固化速度比较慢。

Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing, EP51FL offers a relatively rapid cure, with a setup time in most cases of about 30-40 minutes and full cure within 24 hours at room temperature. In addition, EP51FL will cures more quickly at elevated temperatures. It has a convenient one to one mix ratio by weight or by volume. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of greater than 75%. EP51FL will form flexible, high strength bonds on many different substrates including metals, glass, ceramics, wood, various rubbers and many plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP51FL is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where good flexibility and fast cure are desirable property traits. EP51FL withstands thermal and mechanical shocks and has superb resistance to thermal cycling. In addition, EP51FL has been used in cryogenic applications as both an adhesive and sealant. Its service temperature range is 4K to 250°F. A paste version called EP51FLND is also available when a “non-drip” system is required. Also, EP51FL will cure at colder temperatures, as low as 20°F; although it will cure more slowly at room temperature.

硕士邦德聚合物系统EP51FL是一个高度灵活的双组份环氧粘接密封和高性能涂料树脂体系。 虽然大多数flexiblilized环氧树脂配方固化速度很慢，EP51FL提供了一个相对快速固化，具有在约30-40分钟，在室温下24小时内完全固化大多数情况下设置时间。 此外，EP51FL将更加迅速固化在高温下。 它具有重量或体积方便一对一混合比例。 固化后的复合呈现出非常高的剥离强度超过25 PLI与大于75％，伸长率相处。 EP51FL将形成包括金属，玻璃，陶瓷，木材，橡胶和各种塑料很多很多不同的衬底灵活，强度高的债券。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP51FL被广泛用于电子，电气，计算机，光学，金属加工，家电，汽车和航空航天行业，在良好的柔韧性和快速固化是可取的属性特征。 EP51FL承受热和机械冲击和具有高超的耐热循环。 此外，EP51FL已用于低温应用，既是胶粘剂和密封剂。 它的工作温度范围是4K到250 ° F。 一个名为EP51FLND糊版时也可用“非滴灌”系统是必需的。 此外，EP51FL将在较低温度下固化，在20 ° F低，虽然会在室温下固化速度比较慢。

Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing, EP51FL offers a relatively rapid cure, with a setup time in most cases of about 30-40 minutes and full cure within 24 hours at room temperature. In addition, EP51FL will cures more quickly at elevated temperatures. It has a convenient one to one mix ratio by weight or by volume. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of greater than 75%. EP51FL will form flexible, high strength bonds on many different substrates including metals, glass, ceramics, wood, various rubbers and many plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP51FL is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where good flexibility and fast cure are desirable property traits. EP51FL withstands thermal and mechanical shocks and has superb resistance to thermal cycling. In addition, EP51FL has been used in cryogenic applications as both an adhesive and sealant. Its service temperature range is 4K to 250°F. A paste version called EP51FLND is also available when a “non-drip” system is required. Also, EP51FL will cure at colder temperatures, as low as 20°F; although it will cure more slowly at room temperature.

硕士邦德聚合物系统EP51FL是一个高度灵活的双组份环氧粘接密封和高性能涂料树脂体系。 虽然大多数flexiblilized环氧树脂配方固化速度很慢，EP51FL提供了一个相对快速固化，具有在约30-40分钟，在室温下24小时内完全固化大多数情况下设置时间。 此外，EP51FL将更加迅速固化在高温下。 它具有重量或体积方便一对一混合比例。 固化后的复合呈现出非常高的剥离强度超过25 PLI与大于75％，伸长率相处。 EP51FL将形成包括金属，玻璃，陶瓷，木材，橡胶和各种塑料很多很多不同的衬底灵活，强度高的债券。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP51FL被广泛用于电子，电气，计算机，光学，金属加工，家电，汽车和航空航天行业，在良好的柔韧性和快速固化是可取的属性特征。 EP51FL承受热和机械冲击和具有高超的耐热循环。 此外，EP51FL已用于低温应用，既是胶粘剂和密封剂。 它的工作温度范围是4K到250 ° F。 一个名为EP51FLND糊版时也可用“非滴灌”系统是必需的。 此外，EP51FL将在较低温度下固化，在20 ° F低，虽然会在室温下固化速度比较慢。

Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing, EP51FL offers a relatively rapid cure, with a setup time in most cases of about 30-40 minutes and full cure within 24 hours at room temperature. In addition, EP51FL will cures more quickly at elevated temperatures. It has a convenient one to one mix ratio by weight or by volume. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of greater than 75%. EP51FL will form flexible, high strength bonds on many different substrates including metals, glass, ceramics, wood, various rubbers and many plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP51FL is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where good flexibility and fast cure are desirable property traits. EP51FL withstands thermal and mechanical shocks and has superb resistance to thermal cycling. In addition, EP51FL has been used in cryogenic applications as both an adhesive and sealant. Its service temperature range is 4K to 250°F. A paste version called EP51FLND is also available when a “non-drip” system is required. Also, EP51FL will cure at colder temperatures, as low as 20°F; although it will cure more slowly at room temperature.