硕士邦德聚合物体系EP75 – 1是一种双组分，石墨填充，导电性能高粘接，密封，并制定治愈在室温或高温下更迅速环氧树脂涂料。 该EP75 – 1系统的混合比例是100重量15。 它易于开发了超过1500磅拉伸剪切粘接强度高。 该固化系统体积电阻率为50至100欧姆厘米。 由于EP75 – 1石墨填充，该系统还具有磁性特性以及高润滑性。 EP75 – 1不含溶剂或稀释剂。 硕士邦德聚合物体系EP75 – 1可以应用于最小下垂或垂直的表面上，甚至淋漓，虽然它可以通过增加重量的5〜10％稀释剂适当的，如二甲苯，丙酮或丁酮溶剂。 高强度债券是非常适应热循环和耐包括水，油，酸和碱的化学物质。 温度范围为-60 ° F至+250 ° F。 粘附于金属，玻璃，陶瓷，硫化橡胶和多种塑料是非常好的。 硕士邦德EP75 – 1胶粘剂广泛用于电子，电气，计算机，半导体，微波，家电和汽车行业，等等。 它特别在应用中的导电胶不应该有任何的磁性或在良好的润滑需要应用。

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents. Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.

硕士邦德聚合物体系EP75 – 1是一种双组分，石墨填充，导电性能高粘接，密封，并制定治愈在室温或高温下更迅速环氧树脂涂料。 该EP75 – 1系统的混合比例是100重量15。 它易于开发了超过1500磅拉伸剪切粘接强度高。 该固化系统体积电阻率为50至100欧姆厘米。 由于EP75 – 1石墨填充，该系统还具有磁性特性以及高润滑性。 EP75 – 1不含溶剂或稀释剂。 硕士邦德聚合物体系EP75 – 1可以应用于最小下垂或垂直的表面上，甚至淋漓，虽然它可以通过增加重量的5〜10％稀释剂适当的，如二甲苯，丙酮或丁酮溶剂。 高强度债券是非常适应热循环和耐包括水，油，酸和碱的化学物质。 温度范围为-60 ° F至+250 ° F。 粘附于金属，玻璃，陶瓷，硫化橡胶和多种塑料是非常好的。 硕士邦德EP75 – 1胶粘剂广泛用于电子，电气，计算机，半导体，微波，家电和汽车行业，等等。 它特别在应用中的导电胶不应该有任何的磁性或在良好的润滑需要应用。

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents. Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.