硕士邦德聚合物体系EP75 – 1是一种二组分，石墨填充，高性能的粘接，密封，并制定在室温下或在高温下更迅速地治愈涂层的导电环氧树脂。 EP75 – 1系统的混合比例是按重量100 15。 它很容易发展了超过1500 psi的抗拉，抗剪粘接强度高。 固化系统的体积电阻是50到100欧姆厘米。 由于EP75 – 1是石墨填充，该系统还具有磁性的特性以及高润滑性。 EP75 – 1不含溶剂或稀释剂。 硕士邦德聚合物体系EP75 – 1可以应用于以最小下垂或淋漓，即使在垂直面上，虽然它可以制成重量增加5％至10％，更薄的一个适当的溶剂，如二甲苯，丙酮或丁酮。 高强度债券显着，适应热循环和耐化学品，包括水，油，酸和碱。 温度范围为-60 ° F至+250 ° F。 金属，玻璃，陶瓷，硫化橡胶和多种塑料粘合性非常出色。 硕士邦德EP75 – 1胶粘剂被广泛应用于电子，电气，计算机，半导体，微波，家电和汽车行业，等等。 特别是在应用中，导电胶，不应该有任何磁学性质，或在需要良好的润滑应用的有用。

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents. Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.

硕士邦德聚合物体系EP75 – 1是一种二组分，石墨填充，高性能的粘接，密封，并制定在室温下或在高温下更迅速地治愈涂层的导电环氧树脂。 EP75 – 1系统的混合比例是按重量100 15。 它很容易发展了超过1500 psi的抗拉，抗剪粘接强度高。 固化系统的体积电阻是50到100欧姆厘米。 由于EP75 – 1是石墨填充，该系统还具有磁性的特性以及高润滑性。 EP75 – 1不含溶剂或稀释剂。 硕士邦德聚合物体系EP75 – 1可以应用于以最小下垂或淋漓，即使在垂直面上，虽然它可以制成重量增加5％至10％，更薄的一个适当的溶剂，如二甲苯，丙酮或丁酮。 高强度债券显着，适应热循环和耐化学品，包括水，油，酸和碱。 温度范围为-60 ° F至+250 ° F。 金属，玻璃，陶瓷，硫化橡胶和多种塑料粘合性非常出色。 硕士邦德EP75 – 1胶粘剂被广泛应用于电子，电气，计算机，半导体，微波，家电和汽车行业，等等。 特别是在应用中，导电胶，不应该有任何磁学性质，或在需要良好的润滑应用的有用。

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents. Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.

硕士邦德聚合物体系EP75 – 1是一种二组分，石墨填充，高性能的粘接，密封，并制定在室温下或在高温下更迅速地治愈涂层的导电环氧树脂。 EP75 – 1系统的混合比例是按重量100 15。 它很容易发展了超过1500 psi的抗拉，抗剪粘接强度高。 固化系统的体积电阻是50到100欧姆厘米。 由于EP75 – 1是石墨填充，该系统还具有磁性的特性以及高润滑性。 EP75 – 1不含溶剂或稀释剂。 硕士邦德聚合物体系EP75 – 1可以应用于以最小下垂或淋漓，即使在垂直面上，虽然它可以制成重量增加5％至10％，更薄的一个适当的溶剂，如二甲苯，丙酮或丁酮。 高强度债券显着，适应热循环和耐化学品，包括水，油，酸和碱。 温度范围为-60 ° F至+250 ° F。 金属，玻璃，陶瓷，硫化橡胶和多种塑料粘合性非常出色。 硕士邦德EP75 – 1胶粘剂被广泛应用于电子，电气，计算机，半导体，微波，家电和汽车行业，等等。 特别是在应用中，导电胶，不应该有任何磁学性质，或在需要良好的润滑应用的有用。

Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It readily develops a high bonding strength of more than 1500 psi tensile shear. The volume resistivity of the cured system is 50 to 100 ohm-cm. Since EP75-1 is graphite filled, the system also features nonmagnetic properties as well as high lubricity. EP75-1 contains no solvents or diluents. Master Bond Polymer System EP75-1 can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner by adding 5 to 10% by weight of an appropriate solvent such as xylene, acetone or MEK. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oils, acids and bases. The temperature range is -60°F to +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Master Bond EP75-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries, among others. It is particularly useful in applications where the conductive adhesive should not have any magnetic properties or in applications where good lubricity is needed.