硕士邦德X – 5HT胶系统是一种高性能的结构零件的热固化胶粘剂。 这需要大量的胶粘剂300 ° F最低温度影响固化。 它是专为在快速固化所需的应用和耐热性高，达至温度高达500 ° F。 该产品提供了卓越的韧性，即使在400-500和灵活性° F的温度范围。 该粘合剂固化在300 ° F – 400 °，约15分钟F。 正面接触压力必须应用在固化过程，以保证良好的粘接。 所需要的压力大小取决于柔软或基材的硬度，并且可能需要对某些较软的材料50PSI。 该胶经历了一个治本，创造优越的性能特点与高强度，结构，热塑性债券。 硕士邦德X5HT粘合剂粘合，必须与同时加热加压固化，无论是在热压机或在与夹烤箱。 它不会在室温下固化。 要粘接涂层项目不能单独加热，然后在寒冷的保税记者。 主键X5HT粘接系统不推荐​​冷或潮湿粘接或溶剂活化。 它包含了低沸点溶剂如酮提供30％的固体。 该硕士邦德X5HT胶粘剂的耐热性是突出表现在其出色的高温尺寸稳定性和抗蠕变在高温下持续的负荷。 该X5HT可以维持超过10磅无限期即使在温度高达500 ° F高后完全固化。 硕士邦德聚合物系统X5HT很好地坚持广泛的承印物。 它具有优异的附着力，对金属，聚合物，复合材料，玻璃和陶瓷。 典型的胶粘剂性能数据列于表2。 该产品不推荐用于粘接聚乙烯，pololefins，含氟聚合物和某些聚酯。 其强度性能是在高温下保持优秀。 硕士邦德聚合物系统X5HT含有挥发性溶剂。 处理，使用和本产品储存适当的预防措施是强烈建议。

Master Bond X-5HT adhesive system is a one part high performance structural thermal curing adhesive. This adhesive requires a minimum temperature of 300°F to effect curing. It is specifically designed for applications where fast-curing is desired and for heat resistance up to temperatures as high as 500°F. This product offers outstanding toughness and flexibility even in the 400-500°F temperature range. The adhesives cures at 300°F – 400°F in approximately 15 minutes. Positive contact pressure must be applied during the curing process to assure good bonding. The amount of pressure needed depends on the softness or hardness of the substrates and may require 50psi for certain relatively soft materials. The adhesive undergoes a permanent cure that creates high strength, structural, thermoplastic bonds, with superior performance characteristics. Master Bond X5HT adhesive must be bonded and cured with simultanous heat and pressure, either in a hot press or in an oven with clamps. It will not cure at room temperature. Coated items to be bonded cannot be heated separately and then bonded in a cold press. The Master Bond X5HT adhesive system is not recommended for cold or wet bonding or for solvent reactivation. It contains 30% solids in a low boiling ketone solvent as supplied. The outstanding heat resistance of the Master Bond X5HT adhesive is demonstrated by its excellent high temperature dimensional stability and resistance to creep under a sustained load at elevated temperatures. The X5HT can sustain more than 10 psi indefinitely even at temperatures as high as 500°F after full cure. Master Bond Polymer System X5HT adheres well to a wide range of substrates. It exhibits excellent adhesion to metals, polymers, composites, glass, and ceramics. Typical adhesive performance data is summarized in table 2. This product is not recommend for bonding polyethylenes, pololefins, fluoropolymers and certain polyesters. The retention of its strength properties at elevated temperatures is outstanding. Master Bond Polymer System X5HT contains a volatile solvent. Appropriate precautions for handling, use, and storage of this product is highly recommended.

硕士邦德X – 5HT胶系统是一种高性能的结构零件的热固化胶粘剂。 这需要大量的胶粘剂300 ° F最低温度影响固化。 它是专为在快速固化所需的应用和耐热性高，达至温度高达500 ° F。 该产品提供了卓越的韧性，即使在400-500和灵活性° F的温度范围。 该粘合剂固化在300 ° F – 400 °，约15分钟F。 正面接触压力必须应用在固化过程，以保证良好的粘接。 所需要的压力大小取决于柔软或基材的硬度，并且可能需要对某些较软的材料50PSI。 该胶经历了一个治本，创造优越的性能特点与高强度，结构，热塑性债券。 硕士邦德X5HT粘合剂粘合，必须与同时加热加压固化，无论是在热压机或在与夹烤箱。 它不会在室温下固化。 要粘接涂层项目不能单独加热，然后在寒冷的保税记者。 主键X5HT粘接系统不推荐​​冷或潮湿粘接或溶剂活化。 它包含了低沸点溶剂如酮提供30％的固体。 该硕士邦德X5HT胶粘剂的耐热性是突出表现在其出色的高温尺寸稳定性和抗蠕变在高温下持续的负荷。 该X5HT可以维持超过10磅无限期即使在温度高达500 ° F高后完全固化。 硕士邦德聚合物系统X5HT很好地坚持广泛的承印物。 它具有优异的附着力，对金属，聚合物，复合材料，玻璃和陶瓷。 典型的胶粘剂性能数据列于表2。 该产品不推荐用于粘接聚乙烯，pololefins，含氟聚合物和某些聚酯。 其强度性能是在高温下保持优秀。 硕士邦德聚合物系统X5HT含有挥发性溶剂。 处理，使用和本产品储存适当的预防措施是强烈建议。

Master Bond X-5HT adhesive system is a one part high performance structural thermal curing adhesive. This adhesive requires a minimum temperature of 300°F to effect curing. It is specifically designed for applications where fast-curing is desired and for heat resistance up to temperatures as high as 500°F. This product offers outstanding toughness and flexibility even in the 400-500°F temperature range. The adhesives cures at 300°F – 400°F in approximately 15 minutes. Positive contact pressure must be applied during the curing process to assure good bonding. The amount of pressure needed depends on the softness or hardness of the substrates and may require 50psi for certain relatively soft materials. The adhesive undergoes a permanent cure that creates high strength, structural, thermoplastic bonds, with superior performance characteristics. Master Bond X5HT adhesive must be bonded and cured with simultanous heat and pressure, either in a hot press or in an oven with clamps. It will not cure at room temperature. Coated items to be bonded cannot be heated separately and then bonded in a cold press. The Master Bond X5HT adhesive system is not recommended for cold or wet bonding or for solvent reactivation. It contains 30% solids in a low boiling ketone solvent as supplied. The outstanding heat resistance of the Master Bond X5HT adhesive is demonstrated by its excellent high temperature dimensional stability and resistance to creep under a sustained load at elevated temperatures. The X5HT can sustain more than 10 psi indefinitely even at temperatures as high as 500°F after full cure. Master Bond Polymer System X5HT adheres well to a wide range of substrates. It exhibits excellent adhesion to metals, polymers, composites, glass, and ceramics. Typical adhesive performance data is summarized in table 2. This product is not recommend for bonding polyethylenes, pololefins, fluoropolymers and certain polyesters. The retention of its strength properties at elevated temperatures is outstanding. Master Bond Polymer System X5HT contains a volatile solvent. Appropriate precautions for handling, use, and storage of this product is highly recommended.

硕士邦德X – 5HT胶系统是一种高性能的结构零件的热固化胶粘剂。 这需要大量的胶粘剂300 ° F最低温度影响固化。 它是专为在快速固化所需的应用和耐热性高，达至温度高达500 ° F。 该产品提供了卓越的韧性，即使在400-500和灵活性° F的温度范围。 该粘合剂固化在300 ° F – 400 °，约15分钟F。 正面接触压力必须应用在固化过程，以保证良好的粘接。 所需要的压力大小取决于柔软或基材的硬度，并且可能需要对某些较软的材料50PSI。 该胶经历了一个治本，创造优越的性能特点与高强度，结构，热塑性债券。 硕士邦德X5HT粘合剂粘合，必须与同时加热加压固化，无论是在热压机或在与夹烤箱。 它不会在室温下固化。 要粘接涂层项目不能单独加热，然后在寒冷的保税记者。 主键X5HT粘接系统不推荐​​冷或潮湿粘接或溶剂活化。 它包含了低沸点溶剂如酮提供30％的固体。 该硕士邦德X5HT胶粘剂的耐热性是突出表现在其出色的高温尺寸稳定性和抗蠕变在高温下持续的负荷。 该X5HT可以维持超过10磅无限期即使在温度高达500 ° F高后完全固化。 硕士邦德聚合物系统X5HT很好地坚持广泛的承印物。 它具有优异的附着力，对金属，聚合物，复合材料，玻璃和陶瓷。 典型的胶粘剂性能数据列于表2。 该产品不推荐用于粘接聚乙烯，pololefins，含氟聚合物和某些聚酯。 其强度性能是在高温下保持优秀。 硕士邦德聚合物系统X5HT含有挥发性溶剂。 处理，使用和本产品储存适当的预防措施是强烈建议。

Master Bond X-5HT adhesive system is a one part high performance structural thermal curing adhesive. This adhesive requires a minimum temperature of 300°F to effect curing. It is specifically designed for applications where fast-curing is desired and for heat resistance up to temperatures as high as 500°F. This product offers outstanding toughness and flexibility even in the 400-500°F temperature range. The adhesives cures at 300°F – 400°F in approximately 15 minutes. Positive contact pressure must be applied during the curing process to assure good bonding. The amount of pressure needed depends on the softness or hardness of the substrates and may require 50psi for certain relatively soft materials. The adhesive undergoes a permanent cure that creates high strength, structural, thermoplastic bonds, with superior performance characteristics. Master Bond X5HT adhesive must be bonded and cured with simultanous heat and pressure, either in a hot press or in an oven with clamps. It will not cure at room temperature. Coated items to be bonded cannot be heated separately and then bonded in a cold press. The Master Bond X5HT adhesive system is not recommended for cold or wet bonding or for solvent reactivation. It contains 30% solids in a low boiling ketone solvent as supplied. The outstanding heat resistance of the Master Bond X5HT adhesive is demonstrated by its excellent high temperature dimensional stability and resistance to creep under a sustained load at elevated temperatures. The X5HT can sustain more than 10 psi indefinitely even at temperatures as high as 500°F after full cure. Master Bond Polymer System X5HT adheres well to a wide range of substrates. It exhibits excellent adhesion to metals, polymers, composites, glass, and ceramics. Typical adhesive performance data is summarized in table 2. This product is not recommend for bonding polyethylenes, pololefins, fluoropolymers and certain polyesters. The retention of its strength properties at elevated temperatures is outstanding. Master Bond Polymer System X5HT contains a volatile solvent. Appropriate precautions for handling, use, and storage of this product is highly recommended.