UV15DC80

UV15DC80 Master Bond, Inc.

硕士邦德UV15DC80是一个非常特殊的双重固化(UV /热)固化系统具有的能力,治愈阴影走出的补充加热固化15-30分钟,在80 ° C的地方。 此外,UV15DC80已包括无与伦比的高超随着温度和耐化学性体力特色突出的物理性能。 UV15DC80是100%固含量,不含溶剂或挥发性物质。 该系统采用了低粘度阳离子型固化体系,固化后收缩率低。 UV15DC80形式的高强度债券,金属,玻璃,陶瓷和大多数塑料。 UV15DC80不抑制氧气。 直UV固化可以完成厚度为.010“/ .020”在365nm的使用与每厘米30-40 millwatts能源²紫外线秒。 可以实现更快的固化在更高的能量输出。 区未治愈,因为阴影是可以治愈的,在80分钟为15-30 ° C。 此外,固化后在125-135 ° C,每15-30分钟就可以增加90 ° C的Tg达到直紫外光固化与后固化超过130 ° C。 在环境温度在未开封的容器贮存期为6个月。

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics along with unmatched temperature and chemical resistance. UV15DC80 is 100% solids and contains no solvents or volatiles. This low viscosity system features a cationic type curing system, with low shrinkage upon curing. UV15DC80 forms high strength bonds to metals, glass, ceramics and most plastics. UV15DC80 is not inhibited by oxygen. Straight UV curing can be accomplished for thickness of .010″/.020″ in seconds using UV light at 365nm with 30-40 millwatts per cm² of energy. Faster cures can be acheived at higher energy outputs. Areas not cured because of shadowing can be cured at 80°C for 15-30 minutes. In addition, post curing at 125-135°C per 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C with a post cure. The storage life in unopened container at ambient temperature is 6 months.

技术参数/Specifications

Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Chemical System Polyurethane
Type / Form Liquid
Cure / Technology Thermoset (optional feature); UV or Radiation Cured; Single Component
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV15DC80,硕士邦德公司,热固性粘合剂,UV15DC80, Master Bond, Inc., Thermoset Adhesives

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UV15DC80

UV15DC80 Master Bond, Inc.

硕士邦德UV15DC80是一个非常特殊的双重固化(UV /热)固化系统具有的能力,治愈阴影走出的补充加热固化15-30分钟,在80 ° C的地方。 此外,UV15DC80已包括无与伦比的高超随着温度和耐化学性体力特色突出的物理性能。 UV15DC80是100%固含量,不含溶剂或挥发性物质。 该系统采用了低粘度阳离子型固化体系,固化后收缩率低。 UV15DC80形式的高强度债券,金属,玻璃,陶瓷和大多数塑料。 UV15DC80不抑制氧气。 直UV固化可以完成厚度为.010“/ .020”在365nm的使用与每厘米30-40 millwatts能源²紫外线秒。 可以实现更快的固化在更高的能量输出。 区未治愈,因为阴影是可以治愈的,在80分钟为15-30 ° C。 此外,固化后在125-135 ° C,每15-30分钟就可以增加90 ° C的Tg达到直紫外光固化与后固化超过130 ° C。 在环境温度在未开封的容器贮存期为6个月。

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics along with unmatched temperature and chemical resistance. UV15DC80 is 100% solids and contains no solvents or volatiles. This low viscosity system features a cationic type curing system, with low shrinkage upon curing. UV15DC80 forms high strength bonds to metals, glass, ceramics and most plastics. UV15DC80 is not inhibited by oxygen. Straight UV curing can be accomplished for thickness of .010″/.020″ in seconds using UV light at 365nm with 30-40 millwatts per cm² of energy. Faster cures can be acheived at higher energy outputs. Areas not cured because of shadowing can be cured at 80°C for 15-30 minutes. In addition, post curing at 125-135°C per 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C with a post cure. The storage life in unopened container at ambient temperature is 6 months.

技术参数/Specifications

Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Chemical System Polyurethane
Type / Form Liquid
Cure / Technology Thermoset (optional feature); UV or Radiation Cured; Single Component
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV15DC80,硕士邦德公司,热固性粘合剂,UV15DC80, Master Bond, Inc., Thermoset Adhesives

Related posts

UV15DC80

UV15DC80 Master Bond, Inc.

硕士邦德UV15DC80是一个非常特殊的双重固化(UV /热)固化系统具有的能力,治愈阴影走出的补充加热固化15-30分钟,在80 ° C的地方。 此外,UV15DC80已包括无与伦比的高超随着温度和耐化学性体力特色突出的物理性能。 UV15DC80是100%固含量,不含溶剂或挥发性物质。 该系统采用了低粘度阳离子型固化体系,固化后收缩率低。 UV15DC80形式的高强度债券,金属,玻璃,陶瓷和大多数塑料。 UV15DC80不抑制氧气。 直UV固化可以完成厚度为.010“/ .020”在365nm的使用与每厘米30-40 millwatts能源²紫外线秒。 可以实现更快的固化在更高的能量输出。 区未治愈,因为阴影是可以治愈的,在80分钟为15-30 ° C。 此外,固化后在125-135 ° C,每15-30分钟就可以增加90 ° C的Tg达到直紫外光固化与后固化超过130 ° C。 在环境温度在未开封的容器贮存期为6个月。

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics along with unmatched temperature and chemical resistance. UV15DC80 is 100% solids and contains no solvents or volatiles. This low viscosity system features a cationic type curing system, with low shrinkage upon curing. UV15DC80 forms high strength bonds to metals, glass, ceramics and most plastics. UV15DC80 is not inhibited by oxygen. Straight UV curing can be accomplished for thickness of .010″/.020″ in seconds using UV light at 365nm with 30-40 millwatts per cm² of energy. Faster cures can be acheived at higher energy outputs. Areas not cured because of shadowing can be cured at 80°C for 15-30 minutes. In addition, post curing at 125-135°C per 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C with a post cure. The storage life in unopened container at ambient temperature is 6 months.

技术参数/Specifications

Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Chemical System Polyurethane
Type / Form Liquid
Cure / Technology Thermoset (optional feature); UV or Radiation Cured; Single Component
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV15DC80,硕士邦德公司,热固性粘合剂,UV15DC80, Master Bond, Inc., Thermoset Adhesives

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