MS726

MS726 Master Bond, Inc.

硕士邦德聚合物系统MasterSil#726是一种非固化油脂状导热硅化合物。 这是非常稳定,也不会干,治,变硬,或出血,甚至暴露在温度高达200C(392F)高。 MS#726上使用的晶体管,二极管,整流器和变压器​​散热和提高性能的电子元件的寿命。

Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.

技术参数/Specifications

Material System
Chemical System Silicone
Composition Unfilled
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Form / Shape Grease, Paste
Composition & Features
Industry Electronics

MS726,硕士邦德公司,导热胶和导热界面材料,MS726, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

Related posts

MS726

MS726 Master Bond, Inc.

硕士邦德聚合物系统MasterSil#726是一种非固化油脂状导热硅化合物。 这是非常稳定,也不会干,治,变硬,或出血,甚至暴露在温度高达200C(392F)高。 MS#726上使用的晶体管,二极管,整流器和变压器​​散热和提高性能的电子元件的寿命。

Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.

技术参数/Specifications

Material System
Chemical System Silicone
Composition Unfilled
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Form / Shape Grease, Paste
Composition & Features
Industry Electronics

MS726,硕士邦德公司,导热胶和导热界面材料,MS726, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

Related posts

MS726

MS726 Master Bond, Inc.

硕士邦德聚合物系统MasterSil#726是一种非固化油脂状导热硅化合物。 这是非常稳定,也不会干,治,变硬,或出血,甚至暴露在温度高达200C(392F)高。 MS#726上使用的晶体管,二极管,整流器和变压器​​散热和提高性能的电子元件的寿命。

Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.

技术参数/Specifications

Material System
Chemical System Silicone
Composition Unfilled
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Form / Shape Grease, Paste
Composition & Features
Industry Electronics

MS726,硕士邦德公司,导热胶和导热界面材料,MS726, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

Related posts