硕士邦德聚合物系统MasterSil＃726是一种非固化油脂状导热硅化合物。 这是非常稳定，也不会干，治，变硬，或出血，甚至暴露在温度高达200C（392F）高。 MS＃726上使用的晶体管，二极管，整流器和变压器散热和提高性能的电子元件的寿命。
Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.
| Compound Type | Thermally Conductive |
| Material Form | Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Silicone |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
MS726,硕士邦德公司,电气树脂和电子化合物,MS726, Master Bond, Inc., Electrical Resins and Electronic Compounds
MS726
硕士邦德聚合物系统MasterSil＃726是一种非固化油脂状导热硅化合物。 这是非常稳定，也不会干，治，变硬，或出血，甚至暴露在温度高达200C（392F）高。 MS＃726上使用的晶体管，二极管，整流器和变压器散热和提高性能的电子元件的寿命。
Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.
| Compound Type | Thermally Conductive |
| Material Form | Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Silicone |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
MS726,硕士邦德公司,电气树脂和电子化合物,MS726, Master Bond, Inc., Electrical Resins and Electronic Compounds
MS726
硕士邦德聚合物系统MasterSil＃726是一种非固化油脂状导热硅化合物。 这是非常稳定，也不会干，治，变硬，或出血，甚至暴露在温度高达200C（392F）高。 MS＃726上使用的晶体管，二极管，整流器和变压器散热和提高性能的电子元件的寿命。
Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to temperatures as high as 200C (392F). MS#726 is used on transistors, diodes, rectifiers and transformers to dissipate heat and to increase performance life of electrical components.
| Compound Type | Thermally Conductive |
| Material Form | Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Silicone |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
MS726,硕士邦德公司,电气树脂和电子化合物,MS726, Master Bond, Inc., Electrical Resins and Electronic Compounds