硕士邦德聚合物MB544系统是一种新型高性能聚酰胺热熔胶成本为快速有效的粘接，灌封和封装。 这种独特的材料很容易处理熔点325-375 ° F范围。 熔化的产品具有优异的附着力，以许多不同的衬底，包括许多难以债券基板。 它也可以很容易地演员和具有优良的韧性，以及卓越的灌封和封装应用的电气绝缘性能。 它长的开放时间是证明特别适用于大型铸件和pottings的理想。 具体的加工优势，包括高生产力，卓越的韧性，消除在传统的双组分粘合剂粘合和铸造涉及的往往是劳动密集的混合操作和灌封化合物和优良的抗热震性。 此外，硕士邦德聚合物系统MB544是100％反应，不含有任何溶剂或其他挥发性物质。 产品符合联邦法规法典第21，第175.105的要求。

Master Bond Polymer System MB544 is a novel high performance polyamide hot melt for fast cost effective bonding, potting and encapsulation. This unique material is readily processed by melting it to the 325-375°F range. The molten product features excellent adhesion to many different substrates including many hard to bond substrates. It can also be easily cast and features excellent toughness as well as superior electrical insulation properties for potting and encapsulation applications. Its long open time is proving particularly desirable for larger castings and pottings. Specific processing advantages include high productivity, superior toughness, elimination of the often labor intensive mixing operations involved in the bonding and casting of conventional two component adhesives and potting compounds and excellent thermal shock resistance. Furthermore, Master Bond Polymer Systems MB544 is 100% reactive and does not contain any solvents or other volatiles. The product meets the requirements of the Code of Federal Regulations, Title 21, Section 175.105.

硕士邦德聚合物MB544系统是一种新型高性能聚酰胺热熔胶成本为快速有效的粘接，灌封和封装。 这种独特的材料很容易处理熔点325-375 ° F范围。 熔化的产品具有优异的附着力，以许多不同的衬底，包括许多难以债券基板。 它也可以很容易地演员和具有优良的韧性，以及卓越的灌封和封装应用的电气绝缘性能。 它长的开放时间是证明特别适用于大型铸件和pottings的理想。 具体的加工优势，包括高生产力，卓越的韧性，消除在传统的双组分粘合剂粘合和铸造涉及的往往是劳动密集的混合操作和灌封化合物和优良的抗热震性。 此外，硕士邦德聚合物系统MB544是100％反应，不含有任何溶剂或其他挥发性物质。 产品符合联邦法规法典第21，第175.105的要求。

Master Bond Polymer System MB544 is a novel high performance polyamide hot melt for fast cost effective bonding, potting and encapsulation. This unique material is readily processed by melting it to the 325-375°F range. The molten product features excellent adhesion to many different substrates including many hard to bond substrates. It can also be easily cast and features excellent toughness as well as superior electrical insulation properties for potting and encapsulation applications. Its long open time is proving particularly desirable for larger castings and pottings. Specific processing advantages include high productivity, superior toughness, elimination of the often labor intensive mixing operations involved in the bonding and casting of conventional two component adhesives and potting compounds and excellent thermal shock resistance. Furthermore, Master Bond Polymer Systems MB544 is 100% reactive and does not contain any solvents or other volatiles. The product meets the requirements of the Code of Federal Regulations, Title 21, Section 175.105.

硕士邦德聚合物MB544系统是一种新型高性能聚酰胺热熔胶成本为快速有效的粘接，灌封和封装。 这种独特的材料很容易处理熔点325-375 ° F范围。 熔化的产品具有优异的附着力，以许多不同的衬底，包括许多难以债券基板。 它也可以很容易地演员和具有优良的韧性，以及卓越的灌封和封装应用的电气绝缘性能。 它长的开放时间是证明特别适用于大型铸件和pottings的理想。 具体的加工优势，包括高生产力，卓越的韧性，消除在传统的双组分粘合剂粘合和铸造涉及的往往是劳动密集的混合操作和灌封化合物和优良的抗热震性。 此外，硕士邦德聚合物系统MB544是100％反应，不含有任何溶剂或其他挥发性物质。 产品符合联邦法规法典第21，第175.105的要求。

Master Bond Polymer System MB544 is a novel high performance polyamide hot melt for fast cost effective bonding, potting and encapsulation. This unique material is readily processed by melting it to the 325-375°F range. The molten product features excellent adhesion to many different substrates including many hard to bond substrates. It can also be easily cast and features excellent toughness as well as superior electrical insulation properties for potting and encapsulation applications. Its long open time is proving particularly desirable for larger castings and pottings. Specific processing advantages include high productivity, superior toughness, elimination of the often labor intensive mixing operations involved in the bonding and casting of conventional two component adhesives and potting compounds and excellent thermal shock resistance. Furthermore, Master Bond Polymer Systems MB544 is 100% reactive and does not contain any solvents or other volatiles. The product meets the requirements of the Code of Federal Regulations, Title 21, Section 175.105.