硕士邦德聚合物系统，MB525，是一种高性能环氧热熔胶复合设计，提供优异的粘接金属，玻璃，木材等基材。 它呈现出相对较低的软化点190-220 ° F，300 ° F和低剥离值低粘度。 粘结强度发展迅速，在很宽的温度范围（-25 ° F至+130 ° F）的维护。 推荐应用温度为230 ° F到260 ° F。 为达到最佳效果，被粘接表面应污垢，油和油脂。

Master Bond Polymer System, MB525, is a high performance epoxy hot melt compound designed to provide excellent adhesion to metals, glass, wood and other substrates. It exhibits a comparatively low softening point of 190-220°F, low viscosity at 300°F and low peel values. Bond strength develops rapidly and is maintained over a wide temperature range (-25°F to +130°F). Recommended application temperature is 230°F to 260°F. for optimal results, surfaces to be bonded should be free of dirt, oil and grease.

硕士邦德聚合物系统，MB525，是一种高性能环氧热熔胶复合设计，提供优异的粘接金属，玻璃，木材等基材。 它呈现出相对较低的软化点190-220 ° F，300 ° F和低剥离值低粘度。 粘结强度发展迅速，在很宽的温度范围（-25 ° F至+130 ° F）的维护。 推荐应用温度为230 ° F到260 ° F。 为达到最佳效果，被粘接表面应污垢，油和油脂。

Master Bond Polymer System, MB525, is a high performance epoxy hot melt compound designed to provide excellent adhesion to metals, glass, wood and other substrates. It exhibits a comparatively low softening point of 190-220°F, low viscosity at 300°F and low peel values. Bond strength develops rapidly and is maintained over a wide temperature range (-25°F to +130°F). Recommended application temperature is 230°F to 260°F. for optimal results, surfaces to be bonded should be free of dirt, oil and grease.