硕士邦德FL901S聚合物系统是一种高性能的银充满不受支持的环氧树脂基胶粘剂电影提供了卓越的性能特点,不需要冷藏,虽然制冷建议,以最大限度地提高保质期。 这家专门开发的一个组成部分制定具有优异的导电性,优越的机械强度,再加上相似和不同基材优异的粘接性能。 这个银的导电膜的额外吸引力的特点是它能够迅速治愈例如1小时,气温适中,在250 ° F(125 ° C)或30-40分钟,在300 ° F(150 ° C)。 标准厚度为3密耳,虽然其他的厚度。 电影过程很容易,挤在粘接是最小的。 硕士邦德FL901S具有良好的导电性比极宽的温度范围从-100 ° F至400 ° F。 即使在高温300 ° C的重量损失小于0.70%。 在室温下硕士邦德FL901S功能的低体积电阻率小于2毫,以及优良的热传导性大于10 BTU•/平方英尺•人力资源•° F。 它可用于粘接基板上的电子元件以及EMI / RFI屏蔽需要的应用程序。 硕士邦德FL901S复膜胶提供轻松方便,适用于非混合系统,特种电子应用所需的高性能配置文件。 债券FL901S法师也可根据要求预制形状。 此外,可申请硕士邦德电影上直接提供的部件,并返回他们对大会的最终用户。
Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal. Master Bond FL901S has excellent electrical conductivity over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally conductivity of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high performance profile required in specialty electronic applications. Master Bond FL901S is also available in preformed shapes upon request. Additionally, Master Bond can apply the film directly onto parts supplied and return them to the end user for assembly.
Material System | |
Chemical System | Epoxy |
Composition | Filled |
Cure / Technology | Single Component |
Form / Shape | Die Bonding Adhesives |
Composition & Features | |
Industry | Electronics |
Features | Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding |
FL901S2,硕士邦德公司,导热胶和导热界面材料,FL901S2, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
FL901S2
硕士邦德FL901S聚合物系统是一种高性能的银充满不受支持的环氧树脂基胶粘剂电影提供了卓越的性能特点,不需要冷藏,虽然制冷建议,以最大限度地提高保质期。 这家专门开发的一个组成部分制定具有优异的导电性,优越的机械强度,再加上相似和不同基材优异的粘接性能。 这个银的导电膜的额外吸引力的特点是它能够迅速治愈例如1小时,气温适中,在250 ° F(125 ° C)或30-40分钟,在300 ° F(150 ° C)。 标准厚度为3密耳,虽然其他的厚度。 电影过程很容易,挤在粘接是最小的。 硕士邦德FL901S具有良好的导电性比极宽的温度范围从-100 ° F至400 ° F。 即使在高温300 ° C的重量损失小于0.70%。 在室温下硕士邦德FL901S功能的低体积电阻率小于2毫,以及优良的热传导性大于10 BTU•/平方英尺•人力资源•° F。 它可用于粘接基板上的电子元件以及EMI / RFI屏蔽需要的应用程序。 硕士邦德FL901S复膜胶提供轻松方便,适用于非混合系统,特种电子应用所需的高性能配置文件。 债券FL901S法师也可根据要求预制形状。 此外,可申请硕士邦德电影上直接提供的部件,并返回他们对大会的最终用户。
Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal. Master Bond FL901S has excellent electrical conductivity over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally conductivity of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high performance profile required in specialty electronic applications. Master Bond FL901S is also available in preformed shapes upon request. Additionally, Master Bond can apply the film directly onto parts supplied and return them to the end user for assembly.
Material System | |
Chemical System | Epoxy |
Composition | Filled |
Cure / Technology | Single Component |
Form / Shape | Die Bonding Adhesives |
Composition & Features | |
Industry | Electronics |
Features | Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding |
FL901S2,硕士邦德公司,导热胶和导热界面材料,FL901S2, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
FL901S2
硕士邦德FL901S聚合物系统是一种高性能的银充满不受支持的环氧树脂基胶粘剂电影提供了卓越的性能特点,不需要冷藏,虽然制冷建议,以最大限度地提高保质期。 这家专门开发的一个组成部分制定具有优异的导电性,优越的机械强度,再加上相似和不同基材优异的粘接性能。 这个银的导电膜的额外吸引力的特点是它能够迅速治愈例如1小时,气温适中,在250 ° F(125 ° C)或30-40分钟,在300 ° F(150 ° C)。 标准厚度为3密耳,虽然其他的厚度。 电影过程很容易,挤在粘接是最小的。 硕士邦德FL901S具有良好的导电性比极宽的温度范围从-100 ° F至400 ° F。 即使在高温300 ° C的重量损失小于0.70%。 在室温下硕士邦德FL901S功能的低体积电阻率小于2毫,以及优良的热传导性大于10 BTU•/平方英尺•人力资源•° F。 它可用于粘接基板上的电子元件以及EMI / RFI屏蔽需要的应用程序。 硕士邦德FL901S复膜胶提供轻松方便,适用于非混合系统,特种电子应用所需的高性能配置文件。 债券FL901S法师也可根据要求预制形状。 此外,可申请硕士邦德电影上直接提供的部件,并返回他们对大会的最终用户。
Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This specially developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure quickly at moderate temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal. Master Bond FL901S has excellent electrical conductivity over an exceptionally wide temperature range from -100°F to 400°F. Even at elevated temperatures of 300°C the weight loss is less than 0.70%. At room temperature Master Bond FL901S features a low volume resistivity of less than 2 milliohms as well as an excellent thermally conductivity of greater than 10 BTU•in/ft²•hr•°F. It can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Master Bond FL901S film adhesive offers the convenience of easy to apply non-mix system along with the high performance profile required in specialty electronic applications. Master Bond FL901S is also available in preformed shapes upon request. Additionally, Master Bond can apply the film directly onto parts supplied and return them to the end user for assembly.
Material System | |
Chemical System | Epoxy |
Composition | Filled |
Cure / Technology | Single Component |
Form / Shape | Die Bonding Adhesives |
Composition & Features | |
Industry | Electronics |
Features | Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding |
FL901S2,硕士邦德公司,导热胶和导热界面材料,FL901S2, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials