硕士邦德聚合物系统FL901AO是一种单组分高性能，导热，电绝缘环氧树脂，以优异的性能特点胶膜。 与许多其他环氧薄膜产品不同的是，它不要求冷藏虽然这是优化保质期的建议。 FL901AO硕士邦德聚合物体系具有优良的导热性，电气绝缘性能高，包括相似，不同基材的高粘结强度性能优越的机械强度。 FL901AO吸引力的另外一个特点是它能够迅速治愈，气温适中，如1小时，在250 ° F（125 ° C）或30-40分钟，在300 ° F（150 ° C）。 硕士邦德聚合物系统FL901AO可在薄膜厚度（标准膜的厚度为3密耳）的范围。 电影过程很容易，挤在粘接是最小的。 硕士邦德聚合物系统FL901AO保留优良的导热性和电气绝缘性能在宽广的温度范围从-100 ° F至400 ° F。 减肥在600 ° F（300 ° C）小于0.6％。 导热措施10 BTU•/平方英尺HR ° F。 体积电阻率超过10 × 10 ¹²欧姆厘米。 这种优越的耐热导电膜产品是广泛采用的电子元件用于粘接热汇一起坚持到微电子封装基板。 它提供了五倍以上的常规（非导电）粘合剂的薄膜产品的导热。 硕士邦德聚合物体系FL901AO也可根据要求的特定形状。 硕士邦德还提供了额外的服务，运用电影直接到零件，然后返回他们为最终用户大会。

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10×10¹² ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.

硕士邦德聚合物系统FL901AO是一种单组分高性能，导热，电绝缘环氧树脂，以优异的性能特点胶膜。 与许多其他环氧薄膜产品不同的是，它不要求冷藏虽然这是优化保质期的建议。 FL901AO硕士邦德聚合物体系具有优良的导热性，电气绝缘性能高，包括相似，不同基材的高粘结强度性能优越的机械强度。 FL901AO吸引力的另外一个特点是它能够迅速治愈，气温适中，如1小时，在250 ° F（125 ° C）或30-40分钟，在300 ° F（150 ° C）。 硕士邦德聚合物系统FL901AO可在薄膜厚度（标准膜的厚度为3密耳）的范围。 电影过程很容易，挤在粘接是最小的。 硕士邦德聚合物系统FL901AO保留优良的导热性和电气绝缘性能在宽广的温度范围从-100 ° F至400 ° F。 减肥在600 ° F（300 ° C）小于0.6％。 导热措施10 BTU•/平方英尺HR ° F。 体积电阻率超过10 × 10 ¹²欧姆厘米。 这种优越的耐热导电膜产品是广泛采用的电子元件用于粘接热汇一起坚持到微电子封装基板。 它提供了五倍以上的常规（非导电）粘合剂的薄膜产品的导热。 硕士邦德聚合物体系FL901AO也可根据要求的特定形状。 硕士邦德还提供了额外的服务，运用电影直接到零件，然后返回他们为最终用户大会。

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10×10¹² ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.