硕士邦德聚合物系统FL901AO是一种单组分高性能导热，电绝缘环氧树脂基胶粘剂以优异的性能特点薄膜。 与许多其他类似的环氧树脂薄膜产品，它不需要冷藏，虽然这是为优化保质期的建议。 硕士邦德聚合物系统FL901AO具有优良的导热，高电绝缘性能和优良的机械强度高的债券，包括为相似，不同基材的强度性能。 另外一个特点是有吸引力的FL901AO它能够在中等温度下固化，如在2501小时迅速° F（125 ° C）30-40分钟或在300 ° F（150 ° C）。 硕士邦德聚合物系统FL901AO可在一个薄膜厚度（标准厚度为3密耳）的范围。 这部电影过程中很容易和挤压粘结的是最小的。 硕士邦德聚合物系统FL901AO保持其优良的热导率在很宽的温度范围从-100 ° F至400 ° F和电气绝缘性能 在600减肥° F（300 ° C）小于0.6％。 热导率的措施10 BTU•在/平方英尺小时° F。 体积电阻率超过10 × 10 ¹²欧姆厘米。 这种优越的热导电膜产品被广泛采用电子元件的粘接热一起坚持到微电子封装基板汇。 它提供了五倍以上的常规（非导电）薄膜产品导热粘合剂。 主键聚合物系统FL901AO也可根据要求在特定的形状。 硕士邦德还提供了直接应用到电影部分，然后返回给最终用户组装额外服务。

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10×10¹² ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.

硕士邦德聚合物系统FL901AO是一种单组分高性能导热，电绝缘环氧树脂基胶粘剂以优异的性能特点薄膜。 与许多其他类似的环氧树脂薄膜产品，它不需要冷藏，虽然这是为优化保质期的建议。 硕士邦德聚合物系统FL901AO具有优良的导热，高电绝缘性能和优良的机械强度高的债券，包括为相似，不同基材的强度性能。 另外一个特点是有吸引力的FL901AO它能够在中等温度下固化，如在2501小时迅速° F（125 ° C）30-40分钟或在300 ° F（150 ° C）。 硕士邦德聚合物系统FL901AO可在一个薄膜厚度（标准厚度为3密耳）的范围。 这部电影过程中很容易和挤压粘结的是最小的。 硕士邦德聚合物系统FL901AO保持其优良的热导率在很宽的温度范围从-100 ° F至400 ° F和电气绝缘性能 在600减肥° F（300 ° C）小于0.6％。 热导率的措施10 BTU•在/平方英尺小时° F。 体积电阻率超过10 × 10 ¹²欧姆厘米。 这种优越的热导电膜产品被广泛采用电子元件的粘接热一起坚持到微电子封装基板汇。 它提供了五倍以上的常规（非导电）薄膜产品导热粘合剂。 主键聚合物系统FL901AO也可根据要求在特定的形状。 硕士邦德还提供了直接应用到电影部分，然后返回给最终用户组装额外服务。

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10×10¹² ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.