硕士邦德高分子胶粘剂EP30医疗是一种二组分非常低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是制定治愈在室温或在evelated温度更迅速容易。 它具有重量4比1的比例混合，不含溶剂或稀释剂。 硕士邦德聚合物体系EP30医药生产高强度，这是非常耐包括水，石油和化学溶剂最orgainc刚性债券，以及冷消毒剂，经贸办和伽玛辐射。 这是维修过的-60 ° F至+ 250 ° F.宽的温度范围 它的债券以及向承印物种类繁多，包括金属，玻璃，陶瓷，木材和许多塑料。 EP30医药治疗后已经非常低衬收缩以及高超的光学清晰度。 固化后的复合也是一个优秀的电绝缘体。 这一点，再加上其超低粘度，使之成为优良的封装和灌封料。 此外，EP30医疗符合USP VI级规格，使其成为一个很好的作为粘合剂，密封剂和涂料的医疗设备多种用途的理想选择。 EP30医疗食品的兼容性也符合FDA的要求。

Master Bond Polymer Adhesive EP30 Medical is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30 Medical produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most orgainc solvents, as well as cold sterilants, ETO and gamma radiation. It is serviceable over the wide temperature range of -60°F to + 250°F. it bonds well to a wide variety of substrates including metals, glass, ceramics, wood and many plastics. EP30 Medical has exceptionally low liner shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled iwth its ultra low viscosity, makes it an excellent encapsulating and potting compound. In addition, EP30 Medical meets USP Class VI specifications, making it well suited for a variety of uses in medical devices as an adhesive, sealant and coating. EP30 Medical also meets FDA requirements for food compatibility.

硕士邦德高分子胶粘剂EP30医疗是一种二组分非常低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是制定治愈在室温或在evelated温度更迅速容易。 它具有重量4比1的比例混合，不含溶剂或稀释剂。 硕士邦德聚合物体系EP30医药生产高强度，这是非常耐包括水，石油和化学溶剂最orgainc刚性债券，以及冷消毒剂，经贸办和伽玛辐射。 这是维修过的-60 ° F至+ 250 ° F.宽的温度范围 它的债券以及向承印物种类繁多，包括金属，玻璃，陶瓷，木材和许多塑料。 EP30医药治疗后已经非常低衬收缩以及高超的光学清晰度。 固化后的复合也是一个优秀的电绝缘体。 这一点，再加上其超低粘度，使之成为优良的封装和灌封料。 此外，EP30医疗符合USP VI级规格，使其成为一个很好的作为粘合剂，密封剂和涂料的医疗设备多种用途的理想选择。 EP30医疗食品的兼容性也符合FDA的要求。

Master Bond Polymer Adhesive EP30 Medical is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30 Medical produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most orgainc solvents, as well as cold sterilants, ETO and gamma radiation. It is serviceable over the wide temperature range of -60°F to + 250°F. it bonds well to a wide variety of substrates including metals, glass, ceramics, wood and many plastics. EP30 Medical has exceptionally low liner shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled iwth its ultra low viscosity, makes it an excellent encapsulating and potting compound. In addition, EP30 Medical meets USP Class VI specifications, making it well suited for a variety of uses in medical devices as an adhesive, sealant and coating. EP30 Medical also meets FDA requirements for food compatibility.

硕士邦德高分子胶粘剂EP30医疗是一种二组分非常低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是制定治愈在室温或在evelated温度更迅速容易。 它具有重量4比1的比例混合，不含溶剂或稀释剂。 硕士邦德聚合物体系EP30医药生产高强度，这是非常耐包括水，石油和化学溶剂最orgainc刚性债券，以及冷消毒剂，经贸办和伽玛辐射。 这是维修过的-60 ° F至+ 250 ° F.宽的温度范围 它的债券以及向承印物种类繁多，包括金属，玻璃，陶瓷，木材和许多塑料。 EP30医药治疗后已经非常低衬收缩以及高超的光学清晰度。 固化后的复合也是一个优秀的电绝缘体。 这一点，再加上其超低粘度，使之成为优良的封装和灌封料。 此外，EP30医疗符合USP VI级规格，使其成为一个很好的作为粘合剂，密封剂和涂料的医疗设备多种用途的理想选择。 EP30医疗食品的兼容性也符合FDA的要求。

Master Bond Polymer Adhesive EP30 Medical is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30 Medical produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most orgainc solvents, as well as cold sterilants, ETO and gamma radiation. It is serviceable over the wide temperature range of -60°F to + 250°F. it bonds well to a wide variety of substrates including metals, glass, ceramics, wood and many plastics. EP30 Medical has exceptionally low liner shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled iwth its ultra low viscosity, makes it an excellent encapsulating and potting compound. In addition, EP30 Medical meets USP Class VI specifications, making it well suited for a variety of uses in medical devices as an adhesive, sealant and coating. EP30 Medical also meets FDA requirements for food compatibility.