硕士邦德聚合物系统EP30DP – 2是一个新的通用双组份环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性和高性能粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点，与那些包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或更厚的厚度截面无论环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 2，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为25 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 2以最小收缩到耐用，高强度和坚韧与弹性明显好了再的抗性热循环和包括水，无机盐，碱和scids以及对异常许多有机化工品固体系统治疗-60 ° F宽的温度范围超过250 ° F。 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色，B部分清除黄色。 硕士邦德聚合物系统EP30DP – 2是广泛采用的电子，电气，计算机，金属加工，家电，汽车和化学加工工业。 它不包含任何自由异氰酸酯，是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP-2 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross sections thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-2 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 25 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-2 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and scids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DP-2 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

硕士邦德聚合物系统EP30DP – 2是一个新的通用双组份环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性和高性能粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点，与那些包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或更厚的厚度截面无论环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 2，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为25 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 2以最小收缩到耐用，高强度和坚韧与弹性明显好了再的抗性热循环和包括水，无机盐，碱和scids以及对异常许多有机化工品固体系统治疗-60 ° F宽的温度范围超过250 ° F。 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色，B部分清除黄色。 硕士邦德聚合物系统EP30DP – 2是广泛采用的电子，电气，计算机，金属加工，家电，汽车和化学加工工业。 它不包含任何自由异氰酸酯，是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP-2 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross sections thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-2 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 25 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-2 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and scids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DP-2 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

硕士邦德聚合物系统EP30DP – 2是一个新的通用双组份环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性和高性能粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点，与那些包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或更厚的厚度截面无论环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 2，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为25 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 2以最小收缩到耐用，高强度和坚韧与弹性明显好了再的抗性热循环和包括水，无机盐，碱和scids以及对异常许多有机化工品固体系统治疗-60 ° F宽的温度范围超过250 ° F。 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色，B部分清除黄色。 硕士邦德聚合物系统EP30DP – 2是广泛采用的电子，电气，计算机，金属加工，家电，汽车和化学加工工业。 它不包含任何自由异氰酸酯，是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP-2 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross sections thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-2 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 25 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-2 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and scids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DP-2 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

硕士邦德聚合物系统EP30DP – 2是一个新的通用双组份环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性和高性能粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点，与那些包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或更厚的厚度截面无论环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 2，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为25 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 2以最小收缩到耐用，高强度和坚韧与弹性明显好了再的抗性热循环和包括水，无机盐，碱和scids以及对异常许多有机化工品固体系统治疗-60 ° F宽的温度范围超过250 ° F。 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色，B部分清除黄色。 硕士邦德聚合物系统EP30DP – 2是广泛采用的电子，电气，计算机，金属加工，家电，汽车和化学加工工业。 它不包含任何自由异氰酸酯，是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP-2 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross sections thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-2 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 25 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-2 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and scids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DP-2 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.