EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分环氧胶粘剂在室温下或在高温下更迅速地制定治疗通用粘接,一到一的比例混合,重量或体积。 它很容易开发出在室温下超过3000 PSI不像许多其他的环氧胶粘剂,是相对不敏感的混合比例或基板的清洗程序的粘接强度高。 它产生了持久的高强度和坚韧,灵活的债券,这是显着的抗热循环和化学品,包括水,油和大多数有机溶剂,极宽的温度范围为-60 ° F到250 ° F。 金属,玻璃,陶瓷,木材,硫化橡胶和多种塑料粘合性非常出色。 硬化的粘合剂是电绝缘体。 部分灰色,B部分琥珀的颜色。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Epoxy; Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Composition & Features
Type / Form Liquid
Features High Dielectric
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,工业粘合剂,EP30AN, Master Bond, Inc., Industrial Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分环氧胶粘剂在室温下或在高温下更迅速地制定治疗通用粘接,一到一的比例混合,重量或体积。 它很容易开发出在室温下超过3000 PSI不像许多其他的环氧胶粘剂,是相对不敏感的混合比例或基板的清洗程序的粘接强度高。 它产生了持久的高强度和坚韧,灵活的债券,这是显着的抗热循环和化学品,包括水,油和大多数有机溶剂,极宽的温度范围为-60 ° F到250 ° F。 金属,玻璃,陶瓷,木材,硫化橡胶和多种塑料粘合性非常出色。 硬化的粘合剂是电绝缘体。 部分灰色,B部分琥珀的颜色。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Epoxy; Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Composition & Features
Type / Form Liquid
Features High Dielectric
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,工业粘合剂,EP30AN, Master Bond, Inc., Industrial Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分环氧胶粘剂在室温下或在高温下更迅速地制定治疗通用粘接,一到一的比例混合,重量或体积。 它很容易开发出在室温下超过3000 PSI不像许多其他的环氧胶粘剂,是相对不敏感的混合比例或基板的清洗程序的粘接强度高。 它产生了持久的高强度和坚韧,灵活的债券,这是显着的抗热循环和化学品,包括水,油和大多数有机溶剂,极宽的温度范围为-60 ° F到250 ° F。 金属,玻璃,陶瓷,木材,硫化橡胶和多种塑料粘合性非常出色。 硬化的粘合剂是电绝缘体。 部分灰色,B部分琥珀的颜色。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Epoxy; Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Composition & Features
Type / Form Liquid
Features High Dielectric
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,工业粘合剂,EP30AN, Master Bond, Inc., Industrial Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分环氧胶粘剂在室温下或在高温下更迅速地制定治疗通用粘接,一到一的比例混合,重量或体积。 它很容易开发出在室温下超过3000 PSI不像许多其他的环氧胶粘剂,是相对不敏感的混合比例或基板的清洗程序的粘接强度高。 它产生了持久的高强度和坚韧,灵活的债券,这是显着的抗热循环和化学品,包括水,油和大多数有机溶剂,极宽的温度范围为-60 ° F到250 ° F。 金属,玻璃,陶瓷,木材,硫化橡胶和多种塑料粘合性非常出色。 硬化的粘合剂是电绝缘体。 部分灰色,B部分琥珀的颜色。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Epoxy; Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Composition & Features
Type / Form Liquid
Features High Dielectric
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,工业粘合剂,EP30AN, Master Bond, Inc., Industrial Adhesives

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