EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 它产生在-60 ° F极宽的温度范围内长期高强度和坚韧,这是明显的抗热循环和包括水,油和有机溶剂的化学品最灵活的债券,到250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,热熔胶,EP30AN, Master Bond, Inc., Hot Melt Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 它产生在-60 ° F极宽的温度范围内长期高强度和坚韧,这是明显的抗热循环和包括水,油和有机溶剂的化学品最灵活的债券,到250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,热熔胶,EP30AN, Master Bond, Inc., Hot Melt Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 它产生在-60 ° F极宽的温度范围内长期高强度和坚韧,这是明显的抗热循环和包括水,油和有机溶剂的化学品最灵活的债券,到250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,热熔胶,EP30AN, Master Bond, Inc., Hot Melt Adhesives

Related posts

EP30AN

EP30AN Master Bond, Inc.

硕士邦德高分子胶粘剂EP21D是一种二组分通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 它产生在-60 ° F极宽的温度范围内长期高强度和坚韧,这是明显的抗热循环和包括水,油和有机溶剂的化学品最灵活的债券,到250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21D胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。

Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP30AN,硕士邦德公司,热熔胶,EP30AN, Master Bond, Inc., Hot Melt Adhesives

Related posts