EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,耐磨耐高性能粘接,密封,浇铸和封装。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的性能特点,包括对聚氨酯的韧性,耐磨性和弹性。 此外EP30DP可在低温下。 它可以很容易地投在厚截面,(例如,几英寸)未经治愈的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP治愈,制定在环境温度或在高温下更迅速。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 一个值得注意的EP30DP特性是它可以更容易地比传统环氧删除。 主债券EP30DP以最小的收缩到耐用,高强度和坚韧与弹性好,耐非常热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修4K以上的极宽的温度范围250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,橡胶硫化,和许多塑料是非常好的。 固化后的化合物是一种卓越的电气绝缘。 部分颜色A是明确的琥珀色,B部分清除黄色。 硕士邦德聚合物系统EP30DP被广泛采用在电子,电器,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working

EP21TPFL-1,硕士邦德公司,热熔粘合剂,EP21TPFL-1, Master Bond, Inc., Hot Melt Adhesives

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EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,耐磨耐高性能粘接,密封,浇铸和封装。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的性能特点,包括对聚氨酯的韧性,耐磨性和弹性。 此外EP30DP可在低温下。 它可以很容易地投在厚截面,(例如,几英寸)未经治愈的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP治愈,制定在环境温度或在高温下更迅速。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 一个值得注意的EP30DP特性是它可以更容易地比传统环氧删除。 主债券EP30DP以最小的收缩到耐用,高强度和坚韧与弹性好,耐非常热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修4K以上的极宽的温度范围250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,橡胶硫化,和许多塑料是非常好的。 固化后的化合物是一种卓越的电气绝缘。 部分颜色A是明确的琥珀色,B部分清除黄色。 硕士邦德聚合物系统EP30DP被广泛采用在电子,电器,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working

EP21TPFL-1,硕士邦德公司,热熔粘合剂,EP21TPFL-1, Master Bond, Inc., Hot Melt Adhesives

Related posts

EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,耐磨耐高性能粘接,密封,浇铸和封装。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的性能特点,包括对聚氨酯的韧性,耐磨性和弹性。 此外EP30DP可在低温下。 它可以很容易地投在厚截面,(例如,几英寸)未经治愈的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP治愈,制定在环境温度或在高温下更迅速。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 一个值得注意的EP30DP特性是它可以更容易地比传统环氧删除。 主债券EP30DP以最小的收缩到耐用,高强度和坚韧与弹性好,耐非常热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修4K以上的极宽的温度范围250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,橡胶硫化,和许多塑料是非常好的。 固化后的化合物是一种卓越的电气绝缘。 部分颜色A是明确的琥珀色,B部分清除黄色。 硕士邦德聚合物系统EP30DP被广泛采用在电子,电器,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working

EP21TPFL-1,硕士邦德公司,热熔粘合剂,EP21TPFL-1, Master Bond, Inc., Hot Melt Adhesives

Related posts

EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,耐磨耐高性能粘接,密封,浇铸和封装。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的性能特点,包括对聚氨酯的韧性,耐磨性和弹性。 此外EP30DP可在低温下。 它可以很容易地投在厚截面,(例如,几英寸)未经治愈的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP治愈,制定在环境温度或在高温下更迅速。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 一个值得注意的EP30DP特性是它可以更容易地比传统环氧删除。 主债券EP30DP以最小的收缩到耐用,高强度和坚韧与弹性好,耐非常热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修4K以上的极宽的温度范围250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,橡胶硫化,和许多塑料是非常好的。 固化后的化合物是一种卓越的电气绝缘。 部分颜色A是明确的琥珀色,B部分清除黄色。 硕士邦德聚合物系统EP30DP被广泛采用在电子,电器,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Material System
Chemical System Polyurethane
Cure / Technology Thermoplastic; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Composition & Features
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working

EP21TPFL-1,硕士邦德公司,热熔粘合剂,EP21TPFL-1, Master Bond, Inc., Hot Melt Adhesives

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