硕士邦德聚合物系统EP21TDC – 2是一个高度灵活的双组份环氧粘接密封性能高，涂层和封装树脂化合物。 它是制订在环境温度下固化或具有方便，非关键一至三个按重量配合比高温更迅速充分。 该固化物具有非常高的超过30 PLI以及一个超过150％的伸长率，剥离强度。 EP21TDC – 2的发展，而很少固化放热，使之成为很好的盆栽或较厚的部分封装适合。 它很好地债券包括金属，玻璃，陶瓷，橡胶和塑料的广泛多种基材。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP21TDC – 2广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，航空航天在卓越的灵活性和相关的属性是需要行业。 EP21TDC – 2一直以来以优异的抗热冲击和机械冲击和振动性能优良的热循环。 此外，EP21TDC – 2同时作为胶粘剂和密封剂在低温环境下广泛的适用性。 它的工作温度范围是4K到250 ° F。 较低的粘度版本，称为EP21TDC – 2LV为“无滴”的版本称为EP21TDC – 2ND以及也可提供。 对EP21TDC – 2的所有三个版本是100％反应，不含溶剂或挥发性物质。

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where excellent flexibility and related properties are desired. EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration. In addition, EP21TDC-2 has wide applicability as both a adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a “non-drip” version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.

硕士邦德聚合物系统EP21TDC – 2是一个高度灵活的双组份环氧粘接密封性能高，涂层和封装树脂化合物。 它是制订在环境温度下固化或具有方便，非关键一至三个按重量配合比高温更迅速充分。 该固化物具有非常高的超过30 PLI以及一个超过150％的伸长率，剥离强度。 EP21TDC – 2的发展，而很少固化放热，使之成为很好的盆栽或较厚的部分封装适合。 它很好地债券包括金属，玻璃，陶瓷，橡胶和塑料的广泛多种基材。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP21TDC – 2广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，航空航天在卓越的灵活性和相关的属性是需要行业。 EP21TDC – 2一直以来以优异的抗热冲击和机械冲击和振动性能优良的热循环。 此外，EP21TDC – 2同时作为胶粘剂和密封剂在低温环境下广泛的适用性。 它的工作温度范围是4K到250 ° F。 较低的粘度版本，称为EP21TDC – 2LV为“无滴”的版本称为EP21TDC – 2ND以及也可提供。 对EP21TDC – 2的所有三个版本是100％反应，不含溶剂或挥发性物质。

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where excellent flexibility and related properties are desired. EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration. In addition, EP21TDC-2 has wide applicability as both a adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a “non-drip” version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.

硕士邦德聚合物系统EP21TDC – 2是一个高度灵活的双组份环氧粘接密封性能高，涂层和封装树脂化合物。 它是制订在环境温度下固化或具有方便，非关键一至三个按重量配合比高温更迅速充分。 该固化物具有非常高的超过30 PLI以及一个超过150％的伸长率，剥离强度。 EP21TDC – 2的发展，而很少固化放热，使之成为很好的盆栽或较厚的部分封装适合。 它很好地债券包括金属，玻璃，陶瓷，橡胶和塑料的广泛多种基材。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP21TDC – 2广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，航空航天在卓越的灵活性和相关的属性是需要行业。 EP21TDC – 2一直以来以优异的抗热冲击和机械冲击和振动性能优良的热循环。 此外，EP21TDC – 2同时作为胶粘剂和密封剂在低温环境下广泛的适用性。 它的工作温度范围是4K到250 ° F。 较低的粘度版本，称为EP21TDC – 2LV为“无滴”的版本称为EP21TDC – 2ND以及也可提供。 对EP21TDC – 2的所有三个版本是100％反应，不含溶剂或挥发性物质。

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where excellent flexibility and related properties are desired. EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration. In addition, EP21TDC-2 has wide applicability as both a adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a “non-drip” version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.

硕士邦德聚合物系统EP21TDC – 2是一个高度灵活的双组份环氧粘接密封性能高，涂层和封装树脂化合物。 它是制订在环境温度下固化或具有方便，非关键一至三个按重量配合比高温更迅速充分。 该固化物具有非常高的超过30 PLI以及一个超过150％的伸长率，剥离强度。 EP21TDC – 2的发展，而很少固化放热，使之成为很好的盆栽或较厚的部分封装适合。 它很好地债券包括金属，玻璃，陶瓷，橡胶和塑料的广泛多种基材。 固化后的环氧树脂是一种优良的电气和热以优异的耐诸如水，油，液压油，盐化工基地和绝缘体。 硕士邦德EP21TDC – 2广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，航空航天在卓越的灵活性和相关的属性是需要行业。 EP21TDC – 2一直以来以优异的抗热冲击和机械冲击和振动性能优良的热循环。 此外，EP21TDC – 2同时作为胶粘剂和密封剂在低温环境下广泛的适用性。 它的工作温度范围是4K到250 ° F。 较低的粘度版本，称为EP21TDC – 2LV为“无滴”的版本称为EP21TDC – 2ND以及也可提供。 对EP21TDC – 2的所有三个版本是100％反应，不含溶剂或挥发性物质。

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where excellent flexibility and related properties are desired. EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration. In addition, EP21TDC-2 has wide applicability as both a adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a “non-drip” version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.