硕士邦德聚合物系统EP30DP – 1是一种新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性及高性能涂料，粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的性能eharacteristics公认的优势，与包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 1，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为50 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 1收缩到最小的耐用，高强度和坚韧与弹性好，耐非常热循环和包括水，无机盐，碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是灰色的，B部分晒黑。 硕士邦德聚合物系统EP30DP – 1被广泛应用于电子，电气，计算机，金属加工，家电，汽车和化学加工行业就业。 它不包含任何免费isoeyanate，是相当安全时使用适当的工业卫生praetiees得到遵守。

Master Bond Polymer System EP30DP-1 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance coating, bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance eharacteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-1 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 50 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-1 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is gray, part B tan. Master Bond Polymer System EP30DP-1 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isoeyanate and is quite safe to use when proper industrial hygiene praetiees are observed.

硕士邦德聚合物系统EP30DP – 1是一种新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性及高性能涂料，粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的性能eharacteristics公认的优势，与包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 1，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为50 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 1收缩到最小的耐用，高强度和坚韧与弹性好，耐非常热循环和包括水，无机盐，碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是灰色的，B部分晒黑。 硕士邦德聚合物系统EP30DP – 1被广泛应用于电子，电气，计算机，金属加工，家电，汽车和化学加工行业就业。 它不包含任何免费isoeyanate，是相当安全时使用适当的工业卫生praetiees得到遵守。

Master Bond Polymer System EP30DP-1 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance coating, bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance eharacteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-1 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 50 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-1 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is gray, part B tan. Master Bond Polymer System EP30DP-1 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isoeyanate and is quite safe to use when proper industrial hygiene praetiees are observed.

硕士邦德聚合物系统EP30DP – 1是一种新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性及高性能涂料，粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的性能eharacteristics公认的优势，与包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 1，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为50 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 1收缩到最小的耐用，高强度和坚韧与弹性好，耐非常热循环和包括水，无机盐，碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是灰色的，B部分晒黑。 硕士邦德聚合物系统EP30DP – 1被广泛应用于电子，电气，计算机，金属加工，家电，汽车和化学加工行业就业。 它不包含任何免费isoeyanate，是相当安全时使用适当的工业卫生praetiees得到遵守。

Master Bond Polymer System EP30DP-1 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance coating, bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance eharacteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-1 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 50 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-1 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is gray, part B tan. Master Bond Polymer System EP30DP-1 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isoeyanate and is quite safe to use when proper industrial hygiene praetiees are observed.

硕士邦德聚合物系统EP30DP – 1是一种新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度，韧性，耐磨性及高性能涂料，粘接，密封，浇铸和封装应用的耐化学性。 它结合了如强度，耐化学性和品质环氧树脂胶粘剂的性能eharacteristics公认的优势，与包括聚氨酯的韧性，耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下（如几英寸）散布未经治疗的发展过程中不必要的放热。 硕士邦德聚合物系统EP30DP – 1，制定治愈在环境温度或在高温下更迅速地与体重的基础上的混合比例为50 100。 这种独特的聚合物系统是100％反应，不含有任何溶剂或稀释剂。 主键EP30DP – 1收缩到最小的耐用，高强度和坚韧与弹性好，耐非常热循环和包括水，无机盐，碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属，混凝土，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是灰色的，B部分晒黑。 硕士邦德聚合物系统EP30DP – 1被广泛应用于电子，电气，计算机，金属加工，家电，汽车和化学加工行业就业。 它不包含任何免费isoeyanate，是相当安全时使用适当的工业卫生praetiees得到遵守。

Master Bond Polymer System EP30DP-1 is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance coating, bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance eharacteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP-1 is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 50 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DP-1 system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is gray, part B tan. Master Bond Polymer System EP30DP-1 is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isoeyanate and is quite safe to use when proper industrial hygiene praetiees are observed.