EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 60000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 28 to 39 µin/in-F; Mechanical: ; Tensile (Break): 7000 psi; Elongation: 5.0 to 6.0 %; Electrical & Optical: ; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 3.80 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding…
EP21-1,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants

EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 60000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 28 to 39 µin/in-F; Mechanical: ; Tensile (Break): 7000 psi; Elongation: 5.0 to 6.0 %; Electrical & Optical: ; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 3.80 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding…
EP21-1,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants

EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 60000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 28 to 39 µin/in-F; Mechanical: ; Tensile (Break): 7000 psi; Elongation: 5.0 to 6.0 %; Electrical & Optical: ; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 3.80 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding…
EP21-1,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants

EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 60000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 28 to 39 µin/in-F; Mechanical: ; Tensile (Break): 7000 psi; Elongation: 5.0 to 6.0 %; Electrical & Optical: ; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 3.80 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding…
EP21-1,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21-1, Master Bond, Inc., Polyurethane Adhesives and Sealants