Master Bond Polymer Adhesive EP51AN is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with a 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive, it forms high strength bonds of over 1200 psi tensile shear. EP51AN resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of 4K to +250°F. The temperature range as indicated allows EP51AN to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51ANLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AN be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. A faster setting version called EP51M-AN; working life 3-5 minutes, full cure 3-4 hours, also is available.

Master Bond Polymer Adhesive EP51AN is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with a 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive, it forms high strength bonds of over 1200 psi tensile shear. EP51AN resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of 4K to +250°F. The temperature range as indicated allows EP51AN to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51ANLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AN be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. A faster setting version called EP51M-AN; working life 3-5 minutes, full cure 3-4 hours, also is available.

Master Bond Polymer Adhesive EP51AN is a two component, thermally conductive, electrically insulating epoxy adhesive, sealant, and coating with a 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive, it forms high strength bonds of over 1200 psi tensile shear. EP51AN resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of 4K to +250°F. The temperature range as indicated allows EP51AN to be used in many cryogenic applications requiring good heat transfer. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP51ANLV is also available. That system is particularly well suited for certain potting applications. It is suggested that Master Bond EP51AN be mixed in small quantities because of its fast gelling properties. It is highly recommended for production line assemblies and high speed bonding operations. A faster setting version called EP51M-AN; working life 3-5 minutes, full cure 3-4 hours, also is available.