One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
Master Bond Polymer System EP3FL is a superior one component epoxy resin system for high performance bonding as well as for potting and encapsulation of sensitive electronic components which are expected to withstand severe environmental conditions in service. Its flexibility and toughness permit it to adjust to both thermal and mechanical stresses without damaging such components. EP3FL combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -100°F to +250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP3FL offers the application convenience of a one component epoxy system which does not require any mixing before use. Although it requires an elevated temperature cure, schedules are flexible to meet specific application requirements. The system features very fast cure times of 5-10 minutes at 300°F and approximately 20-30 minutes at 250°F. It is 100% reactive and does not contain solvents or diluents. The color is yellow/brown.
Product Advantages
- Single component system; no mixing prior to use. Unlimited working life at room temperature.
- Very rapid cure schedules, e.g. 5-10 minutes at 300°F or 20-30 minutes at 250°F.
- Bonds well to a wide variety of substrates.
- Broad service temperature range of 60°F to 250°F.
- Good toughness and flexibility.
- Exceptionally low shrinkage.