MB516, Master Bond, Inc., Polymers and Plastic Materials
Type: MoldingCompound ; Material System: ; Chemical System: Polyamide ; Filler: Unfilled ; Form / Shape: Pellets ; Features & Industry / Applications: ; Industry: Laminating ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: 410 F; Deflection Temperature (F): ; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 500 psi; Tensile Modulus: 12.00 ksi; Elongation: 100.0 %; Electrical: ; Resistivity (ohm-cm): ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption (%): ; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Features excellent thermal stability in the molten state
MB516,硕士邦德公司,聚合物和塑料材料,MB516, Master Bond, Inc., Polymers and Plastic Materials
MB516
MB516, Master Bond, Inc., Polymers and Plastic Materials
Type: MoldingCompound ; Material System: ; Chemical System: Polyamide ; Filler: Unfilled ; Form / Shape: Pellets ; Features & Industry / Applications: ; Industry: Laminating ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: 410 F; Deflection Temperature (F): ; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 500 psi; Tensile Modulus: 12.00 ksi; Elongation: 100.0 %; Electrical: ; Resistivity (ohm-cm): ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption (%): ; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Features excellent thermal stability in the molten state
MB516,硕士邦德公司,聚合物和塑料材料,MB516, Master Bond, Inc., Polymers and Plastic Materials
MB516
MB516, Master Bond, Inc., Polymers and Plastic Materials
Type: MoldingCompound ; Material System: ; Chemical System: Polyamide ; Filler: Unfilled ; Form / Shape: Pellets ; Features & Industry / Applications: ; Industry: Laminating ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: 410 F; Deflection Temperature (F): ; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 500 psi; Tensile Modulus: 12.00 ksi; Elongation: 100.0 %; Electrical: ; Resistivity (ohm-cm): ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption (%): ; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Features excellent thermal stability in the molten state
MB516,硕士邦德公司,聚合物和塑料材料,MB516, Master Bond, Inc., Polymers and Plastic Materials
MB516
MB516, Master Bond, Inc., Polymers and Plastic Materials
Type: MoldingCompound ; Material System: ; Chemical System: Polyamide ; Filler: Unfilled ; Form / Shape: Pellets ; Features & Industry / Applications: ; Industry: Laminating ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: 410 F; Deflection Temperature (F): ; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 500 psi; Tensile Modulus: 12.00 ksi; Elongation: 100.0 %; Electrical: ; Resistivity (ohm-cm): ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption (%): ; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Features excellent thermal stability in the molten state
MB516,硕士邦德公司,聚合物和塑料材料,MB516, Master Bond, Inc., Polymers and Plastic Materials