硕士邦德聚合物系统EP30DPF是一个新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度,韧性,耐磨性和耐化学性能高粘接性,密封性,铸造和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点,与那些包括聚氨酯的韧性,耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下(如几英寸)散布未经固化过程中放热过分发育,opment。 硕士邦德聚合物系统EP30DPF治愈,制定在环境温度或在高温下更迅速地与体重的基础上的混合比例为20 100。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 主债券EP30DPF以最小的收缩到耐用,高强度和弹性具有非常良好的强硬重新的抗性热循环和包括水,无机盐,碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属,混凝土,玻璃,陶瓷,橡胶和woodsvulcanized许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色,B部分清除黄色。 硕士邦德聚合物系统EP30DPF被广泛采用在电子,电气,计算机,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。
Master Bond Polymer System EP30DPF is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the devel-opment of undue exotherm during cure. Master Bond Polymer System EP30DPF is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 20 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DPF system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, woodsvulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DPF is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21LVTP,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21LVTP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVTP
硕士邦德聚合物系统EP30DPF是一个新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度,韧性,耐磨性和耐化学性能高粘接性,密封性,铸造和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点,与那些包括聚氨酯的韧性,耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下(如几英寸)散布未经固化过程中放热过分发育,opment。 硕士邦德聚合物系统EP30DPF治愈,制定在环境温度或在高温下更迅速地与体重的基础上的混合比例为20 100。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 主债券EP30DPF以最小的收缩到耐用,高强度和弹性具有非常良好的强硬重新的抗性热循环和包括水,无机盐,碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属,混凝土,玻璃,陶瓷,橡胶和woodsvulcanized许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色,B部分清除黄色。 硕士邦德聚合物系统EP30DPF被广泛采用在电子,电气,计算机,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。
Master Bond Polymer System EP30DPF is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the devel-opment of undue exotherm during cure. Master Bond Polymer System EP30DPF is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 20 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DPF system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, woodsvulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DPF is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21LVTP,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21LVTP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVTP
硕士邦德聚合物系统EP30DPF是一个新的多功能双组分环氧/聚氨酯弹性体化合物具有优越的强度,韧性,耐磨性和耐化学性能高粘接性,密封性,铸造和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点,与那些包括聚氨酯的韧性,耐磨性和弹性。 它可以很容易地转换或即使在厚截面厚度或环境温度或较高温度下(如几英寸)散布未经固化过程中放热过分发育,opment。 硕士邦德聚合物系统EP30DPF治愈,制定在环境温度或在高温下更迅速地与体重的基础上的混合比例为20 100。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 主债券EP30DPF以最小的收缩到耐用,高强度和弹性具有非常良好的强硬重新的抗性热循环和包括水,无机盐,碱和酸类以及在极宽的温度许多有机化工品固体系统治疗范围为-60 ° F至250 ° F.以上 粘附于金属,混凝土,玻璃,陶瓷,橡胶和woodsvulcanized许多塑料是非常好的。 固化后的复合是一个非常卓越的电气绝缘。 部分颜色A是opague灰色,B部分清除黄色。 硕士邦德聚合物系统EP30DPF被广泛采用在电子,电气,计算机,金属加工,家电,汽车和化学加工工业。 它不包含任何自由异氰酸酯,是相当安全时使用适当的工业卫生习惯得到遵守。
Master Bond Polymer System EP30DPF is a new versatile two component epoxy/urethane elastomer compound featuring superior strength, toughness, abrasion and chemical resistance for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. It can be readily cast or spread at either ambient or elevated temperatures even in thick cross section thickness (e.g. several inches) without the devel-opment of undue exotherm during cure. Master Bond Polymer System EP30DPF is formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 20 mix ratio on a weight basis. This unique polymer system is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30DPF system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good re-sistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, woodsvulcanized rubbers and many plastics is excellent. The cured compound is a very superior electrical insulator. Color of part A is opague gray, part B clear yellow. Master Bond Polymer System EP30DPF is widely employed in the electronics, electrical, computer, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21LVTP,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21LVTP, Master Bond, Inc., Polyurethane Adhesives and Sealants