硕士邦德聚合物系统EP30D – 14是一种独特的多功能双组分聚氨酯弹性体具有光学透明优越的强度,韧性和化学高性能粘结性,密封,浇铸,灌封和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂公认性能优越的特点,与聚氨酯的特点韧性,耐磨性和韧性的。 硕士邦德聚合物系统EP30D – 14配方固化室温或高温下更迅速地与用户友好的一对一的基础上重不重要的混合比例。 它是100%反应,不含有任何溶剂或稀释剂。 这特别明显,以最小的低粘度聚合物收缩到非常高的强度和艰难,非常优越的耐热循环和包括水,无机盐,碱和酸类化学品热固性塑料系统治疗。 硕士邦德聚合物系统EP30D14可在极宽的温度范围-60 ° F至+250 ° F。 粘附于金属,玻璃,水泥,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 固化后的材料是绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德聚合物系统EP30D – 14被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化学过程工业使用。 这是很安全时使用适当的工业卫生习惯观察粘度和固化时间可以很容易地在较宽范围内调整,以最好地满足特定的应用需求。
Master Bond Polymer System EP30D-14 is a uniquely versatile two component optically clear urethane elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting, potting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethane’s characteristic toughness, abrasion resistance and toughness. Master Bond Polymer System EP30D-14 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a user friendly one to one noncritical mix ratio on a weight basis. It is 100% reactive and does not contain any solvents or diluents. This specially clear, low viscosity polymer system cures with minimal shrinkage to a remarkably high strength and tough thermoset plastic with very superior resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids. Master Bond Polymer System EP30D14 can be used over the exceptionally wide temperature range of -60°F to +250°F. Adhesion to metals, glass, concrete, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured material is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30D-14 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries. It is quite safe to use when proper industrial hygiene practices are observed viscosities and cure times can be readily adjusted within wide limits so as to best meet specific application requirements.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP30D-9,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP30D-9, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP30D-9
硕士邦德聚合物系统EP30D – 14是一种独特的多功能双组分聚氨酯弹性体具有光学透明优越的强度,韧性和化学高性能粘结性,密封,浇铸,灌封和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂公认性能优越的特点,与聚氨酯的特点韧性,耐磨性和韧性的。 硕士邦德聚合物系统EP30D – 14配方固化室温或高温下更迅速地与用户友好的一对一的基础上重不重要的混合比例。 它是100%反应,不含有任何溶剂或稀释剂。 这特别明显,以最小的低粘度聚合物收缩到非常高的强度和艰难,非常优越的耐热循环和包括水,无机盐,碱和酸类化学品热固性塑料系统治疗。 硕士邦德聚合物系统EP30D14可在极宽的温度范围-60 ° F至+250 ° F。 粘附于金属,玻璃,水泥,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 固化后的材料是绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德聚合物系统EP30D – 14被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化学过程工业使用。 这是很安全时使用适当的工业卫生习惯观察粘度和固化时间可以很容易地在较宽范围内调整,以最好地满足特定的应用需求。
Master Bond Polymer System EP30D-14 is a uniquely versatile two component optically clear urethane elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting, potting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethane’s characteristic toughness, abrasion resistance and toughness. Master Bond Polymer System EP30D-14 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a user friendly one to one noncritical mix ratio on a weight basis. It is 100% reactive and does not contain any solvents or diluents. This specially clear, low viscosity polymer system cures with minimal shrinkage to a remarkably high strength and tough thermoset plastic with very superior resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids. Master Bond Polymer System EP30D14 can be used over the exceptionally wide temperature range of -60°F to +250°F. Adhesion to metals, glass, concrete, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured material is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30D-14 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries. It is quite safe to use when proper industrial hygiene practices are observed viscosities and cure times can be readily adjusted within wide limits so as to best meet specific application requirements.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP30D-9,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP30D-9, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP30D-9
硕士邦德聚合物系统EP30D – 14是一种独特的多功能双组分聚氨酯弹性体具有光学透明优越的强度,韧性和化学高性能粘结性,密封,浇铸,灌封和封装应用。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂公认性能优越的特点,与聚氨酯的特点韧性,耐磨性和韧性的。 硕士邦德聚合物系统EP30D – 14配方固化室温或高温下更迅速地与用户友好的一对一的基础上重不重要的混合比例。 它是100%反应,不含有任何溶剂或稀释剂。 这特别明显,以最小的低粘度聚合物收缩到非常高的强度和艰难,非常优越的耐热循环和包括水,无机盐,碱和酸类化学品热固性塑料系统治疗。 硕士邦德聚合物系统EP30D14可在极宽的温度范围-60 ° F至+250 ° F。 粘附于金属,玻璃,水泥,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 固化后的材料是绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德聚合物系统EP30D – 14被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化学过程工业使用。 这是很安全时使用适当的工业卫生习惯观察粘度和固化时间可以很容易地在较宽范围内调整,以最好地满足特定的应用需求。
Master Bond Polymer System EP30D-14 is a uniquely versatile two component optically clear urethane elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting, potting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethane’s characteristic toughness, abrasion resistance and toughness. Master Bond Polymer System EP30D-14 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a user friendly one to one noncritical mix ratio on a weight basis. It is 100% reactive and does not contain any solvents or diluents. This specially clear, low viscosity polymer system cures with minimal shrinkage to a remarkably high strength and tough thermoset plastic with very superior resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids. Master Bond Polymer System EP30D14 can be used over the exceptionally wide temperature range of -60°F to +250°F. Adhesion to metals, glass, concrete, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured material is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30D-14 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries. It is quite safe to use when proper industrial hygiene practices are observed viscosities and cure times can be readily adjusted within wide limits so as to best meet specific application requirements.
Compound Type | Adhesive |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP30D-9,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP30D-9, Master Bond, Inc., Polyurethane Adhesives and Sealants