EP30-1

Low Viscosity, Two Component Epoxy Adhesive For High Performance Fiber Optics Bonding, Coating, Casting, Potting and Encapsulation.

EP30-1 Two Component Epoxy

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low—0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A).

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EP30-1

Low Viscosity, Two Component Epoxy Adhesive For High Performance Fiber Optics Bonding, Coating, Casting, Potting and Encapsulation.

EP30-1 Two Component Epoxy

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low—0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A).

Related posts

EP30-1

Low Viscosity, Two Component Epoxy Adhesive For High Performance Fiber Optics Bonding, Coating, Casting, Potting and Encapsulation.

EP30-1 Two Component Epoxy

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low—0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A).

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