EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,抗磨损高性能粘结,密封,浇铸和封装。 它结合了环氧树脂的性能特点,如强度,耐化学性和粘接素质,包括韧性,耐磨性和灵活性的聚氨酯。 此外EP30DP可用于在低温条件下。 它可以很容易地投在厚截面,(例如,几英寸)在固化过程中,没有不必要的放热发展。 硕士邦德聚合物系统EP30DP是在室温条件下或在高温下更迅速地制定治疗。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 EP30DP值得注意的财产之一是,它可以更容易比传统的环氧树脂。 硕士邦德EP30DP以最小的收缩,以耐用,高强度和坚韧的弹性显着良好的耐热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修超过4K的极宽的温度范围,以250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,硫化橡胶,和许多塑料是非常好的。 固化物是一个卓越的电气绝缘。 部分的颜色,一个是明确的琥珀,B部分清黄。 硕士邦德聚合物系统EP30DP是在电子,电器,金属加工,家电,汽车和化学加工行业广泛采用。 它不包含任何自由的异氰酸酯,是相当安全时使用适当的工业卫生习惯观察。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Electrical 
Dielectric Strength 1.65E7 to ?
Dielectric Constant 3.80
Form Adhesives
Material Thermoplastic; Two Component or Catalyst Cured; Epoxy; Polyurethane
Features Electronics / Semiconductors; Electrical Power or High Voltage

EP21TPFL-1,硕士邦德公司,电气绝缘材料和绝缘材料,EP21TPFL-1, Master Bond, Inc., Electrical Insulation and Dielectric Materials

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EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,抗磨损高性能粘结,密封,浇铸和封装。 它结合了环氧树脂的性能特点,如强度,耐化学性和粘接素质,包括韧性,耐磨性和灵活性的聚氨酯。 此外EP30DP可用于在低温条件下。 它可以很容易地投在厚截面,(例如,几英寸)在固化过程中,没有不必要的放热发展。 硕士邦德聚合物系统EP30DP是在室温条件下或在高温下更迅速地制定治疗。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 EP30DP值得注意的财产之一是,它可以更容易比传统的环氧树脂。 硕士邦德EP30DP以最小的收缩,以耐用,高强度和坚韧的弹性显着良好的耐热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修超过4K的极宽的温度范围,以250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,硫化橡胶,和许多塑料是非常好的。 固化物是一个卓越的电气绝缘。 部分的颜色,一个是明确的琥珀,B部分清黄。 硕士邦德聚合物系统EP30DP是在电子,电器,金属加工,家电,汽车和化学加工行业广泛采用。 它不包含任何自由的异氰酸酯,是相当安全时使用适当的工业卫生习惯观察。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Electrical 
Dielectric Strength 1.65E7 to ?
Dielectric Constant 3.80
Form Adhesives
Material Thermoplastic; Two Component or Catalyst Cured; Epoxy; Polyurethane
Features Electronics / Semiconductors; Electrical Power or High Voltage

EP21TPFL-1,硕士邦德公司,电气绝缘材料和绝缘材料,EP21TPFL-1, Master Bond, Inc., Electrical Insulation and Dielectric Materials

Related posts

EP21TPFL-1

EP21TPFL-1 Master Bond, Inc.

硕士邦德聚合物系统EP30DP是一种多用途,双组分,环氧聚氨酯弹性体化合物,具有优越的强度,韧性好,抗磨损高性能粘结,密封,浇铸和封装。 它结合了环氧树脂的性能特点,如强度,耐化学性和粘接素质,包括韧性,耐磨性和灵活性的聚氨酯。 此外EP30DP可用于在低温条件下。 它可以很容易地投在厚截面,(例如,几英寸)在固化过程中,没有不必要的放热发展。 硕士邦德聚合物系统EP30DP是在室温条件下或在高温下更迅速地制定治疗。 这种独特的聚合物系统是100%反应,不含有任何溶剂或稀释剂。 EP30DP值得注意的财产之一是,它可以更容易比传统的环氧树脂。 硕士邦德EP30DP以最小的收缩,以耐用,高强度和坚韧的弹性显着良好的耐热循环,化学品,水,无机盐,碱和酸固体系统的治疗方法。 维修超过4K的极宽的温度范围,以250 ° F。 粘附于金属,混凝土,玻璃,陶瓷,木材,硫化橡胶,和许多塑料是非常好的。 固化物是一个卓越的电气绝缘。 部分的颜色,一个是明确的琥珀,B部分清黄。 硕士邦德聚合物系统EP30DP是在电子,电器,金属加工,家电,汽车和化学加工行业广泛采用。 它不包含任何自由的异氰酸酯,是相当安全时使用适当的工业卫生习惯观察。

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition EP30DP can be used at cryogenic temperatures. It can be readily cast in thick cross sections, (e.g., several inches) without the development of undue exotherm during cure. Master Bond Polymer System EP30DP is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. This unique polymer system is 100% reactive and does not contain any solvents or diluents. One noteworthy property of EP30DP is that it can be more easily removed than conventional epoxies. The Master Bond EP30DP system cures with minimal shrinkage to a durable, high strength and tough elastomeric solid with remarkably good resistance to thermal cycling, chemicals, water, inorganic salts, alkalis and acid. Serviceable over the exceptionally wide temperature range of 4K to +250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The cured compound is a superior electrical insulator. Color of part A is clear amber, part B clear yellow. Master Bond Polymer System EP30DP is widely employed in the electronics, electrical, metalworking, appliance, automotive and chemical processing industries. It does not contain any free isocyanate and is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Electrical 
Dielectric Strength 1.65E7 to ?
Dielectric Constant 3.80
Form Adhesives
Material Thermoplastic; Two Component or Catalyst Cured; Epoxy; Polyurethane
Features Electronics / Semiconductors; Electrical Power or High Voltage

EP21TPFL-1,硕士邦德公司,电气绝缘材料和绝缘材料,EP21TPFL-1, Master Bond, Inc., Electrical Insulation and Dielectric Materials

Related posts