GP555

GP555 Master Bond, Inc.

这是很容易适用于无需混合

It is easy to apply with no mixing required

技术参数/Specifications

Substrate Compatibility Metal
Chemical System Alkyd
Composition Unfilled
Cure / Technology Anaerobic; Thermoset; Single Component
Features Sealant
Industry Construction

GP555,硕士邦德公司,热固性粘合剂,GP555, Master Bond, Inc., Thermoset Adhesives

Related posts

GP555

GP555 Master Bond, Inc.

这是很容易适用于无需混合

It is easy to apply with no mixing required

技术参数/Specifications

Substrate Compatibility Metal
Chemical System Alkyd
Composition Unfilled
Cure / Technology Anaerobic; Thermoset; Single Component
Features Sealant
Industry Construction

GP555,硕士邦德公司,热固性粘合剂,GP555, Master Bond, Inc., Thermoset Adhesives

Related posts

GP555

GP555 Master Bond, Inc.

这是很容易适用于无需混合

It is easy to apply with no mixing required

技术参数/Specifications

Substrate Compatibility Metal
Chemical System Alkyd
Composition Unfilled
Cure / Technology Anaerobic; Thermoset; Single Component
Features Sealant
Industry Construction

GP555,硕士邦德公司,热固性粘合剂,GP555, Master Bond, Inc., Thermoset Adhesives

Related posts