硕士邦德聚合物系统EP30LV是一种低粘度,通用双组份粘接,涂装环氧粘合剂,密封和铸造配方,在室温下固化或以上的五(5)一(1)混合比例升高温度迅速重量。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 硕士邦德聚合物系统EP30LV生产高强度,这是非常耐包括水,油和大多数有机溶剂,以及冷消毒剂,经贸办和伽玛辐射化学品刚性债券。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物系统EP30LV被广泛应用于电子,电气,计算机,光学,金属加工,家电,汽车,化工等行业。
Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. Master Bond Polymer System EP30LV produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30LV is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.
Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Composition & Features | |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
MB529,硕士邦德公司,热熔胶,MB529, Master Bond, Inc., Hot Melt Adhesives
MB529
硕士邦德聚合物系统EP30LV是一种低粘度,通用双组份粘接,涂装环氧粘合剂,密封和铸造配方,在室温下固化或以上的五(5)一(1)混合比例升高温度迅速重量。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 硕士邦德聚合物系统EP30LV生产高强度,这是非常耐包括水,油和大多数有机溶剂,以及冷消毒剂,经贸办和伽玛辐射化学品刚性债券。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物系统EP30LV被广泛应用于电子,电气,计算机,光学,金属加工,家电,汽车,化工等行业。
Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. Master Bond Polymer System EP30LV produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30LV is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.
Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Composition & Features | |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
MB529,硕士邦德公司,热熔胶,MB529, Master Bond, Inc., Hot Melt Adhesives
MB529
硕士邦德聚合物系统EP30LV是一种低粘度,通用双组份粘接,涂装环氧粘合剂,密封和铸造配方,在室温下固化或以上的五(5)一(1)混合比例升高温度迅速重量。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 硕士邦德聚合物系统EP30LV生产高强度,这是非常耐包括水,油和大多数有机溶剂,以及冷消毒剂,经贸办和伽玛辐射化学品刚性债券。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物系统EP30LV被广泛应用于电子,电气,计算机,光学,金属加工,家电,汽车,化工等行业。
Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. Master Bond Polymer System EP30LV produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30LV is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.
Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
Type / Form | Liquid |
Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
Composition & Features | |
Features | High Dielectric |
Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
MB529,硕士邦德公司,热熔胶,MB529, Master Bond, Inc., Hot Melt Adhesives