UV10TK40

UV10TK40 Master Bond, Inc.

UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates ; Chemical System: ; Type / Form: Liquid ; Composition: ; Cure / Technology: UV or Radiation Cured; Single Component ; Features: Flexible; High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Adhesive ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 35000 to 40000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: ? to 0.0290 W/m-K; CTE: 33 to ? µin/in-F; Mechanical: ; Tensile (Break): 8300 psi; Elongation: 6.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission: 95.00 to ? %; Notes: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for…
UV10TK40,硕士邦德公司,特种胶粘剂,密封剂和化合物,UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

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UV10TK40

UV10TK40 Master Bond, Inc.

UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates ; Chemical System: ; Type / Form: Liquid ; Composition: ; Cure / Technology: UV or Radiation Cured; Single Component ; Features: Flexible; High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Adhesive ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 35000 to 40000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: ? to 0.0290 W/m-K; CTE: 33 to ? µin/in-F; Mechanical: ; Tensile (Break): 8300 psi; Elongation: 6.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission: 95.00 to ? %; Notes: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for…
UV10TK40,硕士邦德公司,特种胶粘剂,密封剂和化合物,UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

Related posts

UV10TK40

UV10TK40 Master Bond, Inc.

UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates ; Chemical System: ; Type / Form: Liquid ; Composition: ; Cure / Technology: UV or Radiation Cured; Single Component ; Features: Flexible; High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Adhesive ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 35000 to 40000 cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: ? to 0.0290 W/m-K; CTE: 33 to ? µin/in-F; Mechanical: ; Tensile (Break): 8300 psi; Elongation: 6.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission: 95.00 to ? %; Notes: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for…
UV10TK40,硕士邦德公司,特种胶粘剂,密封剂和化合物,UV10TK40, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

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