Master Bond Polymer Adhesive EP21TDCHT-1 is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing, the EP21TDCHT-1 offers high shear and peel strength which allows it to be used in a number of demanding situations including temperature cycling, high vibration and mechanical shock. It will bond well to most metals, plastics, rubbers, glass and ceramics. The EP21TDCHT-1 is a flexibilized system particularly well suited for bonding dissimilar substrates, especially where the substrates have different coefficients of expansion. EP21TDCHT-1 is an excellent electrical insulator and will resist most chemicals, including water, oils and many organic solvents. The service temperature range is outstanding; from -100°F to +400°F. This versatile system can be used in a range of applications including but not limited to structural, electronic, aerospace, medical and OEM. A non-drip version called E21TDCHTND-1 is also available.

Master Bond Polymer Adhesive EP21TDCHT-1 is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing, the EP21TDCHT-1 offers high shear and peel strength which allows it to be used in a number of demanding situations including temperature cycling, high vibration and mechanical shock. It will bond well to most metals, plastics, rubbers, glass and ceramics. The EP21TDCHT-1 is a flexibilized system particularly well suited for bonding dissimilar substrates, especially where the substrates have different coefficients of expansion. EP21TDCHT-1 is an excellent electrical insulator and will resist most chemicals, including water, oils and many organic solvents. The service temperature range is outstanding; from -100°F to +400°F. This versatile system can be used in a range of applications including but not limited to structural, electronic, aerospace, medical and OEM. A non-drip version called E21TDCHTND-1 is also available.

Master Bond Polymer Adhesive EP21TDCHT-1 is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing, the EP21TDCHT-1 offers high shear and peel strength which allows it to be used in a number of demanding situations including temperature cycling, high vibration and mechanical shock. It will bond well to most metals, plastics, rubbers, glass and ceramics. The EP21TDCHT-1 is a flexibilized system particularly well suited for bonding dissimilar substrates, especially where the substrates have different coefficients of expansion. EP21TDCHT-1 is an excellent electrical insulator and will resist most chemicals, including water, oils and many organic solvents. The service temperature range is outstanding; from -100°F to +400°F. This versatile system can be used in a range of applications including but not limited to structural, electronic, aerospace, medical and OEM. A non-drip version called E21TDCHTND-1 is also available.