硕士邦德聚合物系统EP121 – 2是一种双组分环氧树脂复合触变自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 2随时准备使用混合在方便，非关键的一对一的比例混合的两个组成部分，可在不下垂或滴水垂直表面上​​，甚至应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 阿typicOal推荐具有快速凝胶固化时间为4小时，302 ° F（150℃）。 固化后的主键聚合物系统EP121 – 2可在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用上printed.circuit板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-2 is a two component thixotropic epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-2 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and can be applied without sagging or dripping even on vertical surfaces. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typicOal recommended cure schedule with fast gelation is 4 hours at 302°F (150 C). The cured Master Bond Polymer System EP121-2 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed.circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.

硕士邦德聚合物系统EP121 – 2是一种双组分环氧树脂复合触变自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 2随时准备使用混合在方便，非关键的一对一的比例混合的两个组成部分，可在不下垂或滴水垂直表面上​​，甚至应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 阿typicOal推荐具有快速凝胶固化时间为4小时，302 ° F（150℃）。 固化后的主键聚合物系统EP121 – 2可在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用上printed.circuit板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-2 is a two component thixotropic epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-2 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and can be applied without sagging or dripping even on vertical surfaces. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typicOal recommended cure schedule with fast gelation is 4 hours at 302°F (150 C). The cured Master Bond Polymer System EP121-2 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed.circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.

硕士邦德聚合物系统EP121 – 2是一种双组分环氧树脂复合触变自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 2随时准备使用混合在方便，非关键的一对一的比例混合的两个组成部分，可在不下垂或滴水垂直表面上​​，甚至应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 阿typicOal推荐具有快速凝胶固化时间为4小时，302 ° F（150℃）。 固化后的主键聚合物系统EP121 – 2可在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用上printed.circuit板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-2 is a two component thixotropic epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-2 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and can be applied without sagging or dripping even on vertical surfaces. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typicOal recommended cure schedule with fast gelation is 4 hours at 302°F (150 C). The cured Master Bond Polymer System EP121-2 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed.circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.