硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂灌封和封装的电气结合高物理强度性能，卓越的热冲击和耐热性，惰性水和良好的电绝缘特性的化学品树脂体系。 它有一个从-60 ° F的温度范围内服务超过250 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP121提供的两个组成部分，加上灵活的治疗计划的一比一的比例混合的非关键应用方便，以最好地满足特定的加工要求。 硕士邦德聚合物系统EP121是提供在两个各有超过9个月的最低稳定液体成分时形成于大约75存放于温度+5 ° F. 它很容易准备的灌封或包封在一比一的比例混合非关键，通过简单的重量或体积的两个组分混合。 凝胶时间和固化时间取决于温度。 推荐的凝胶时间为1至11小时212-225 ° F。 完全固化，可达到加热凝胶EP121环氧树脂系统额外1-2个小时，在250 ° F。 在较高温度下固化后1-3小时，例如在300 ° F是可选​​的，其主要好处是在热变形温度提高。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.

硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂灌封和封装的电气结合高物理强度性能，卓越的热冲击和耐热性，惰性水和良好的电绝缘特性的化学品树脂体系。 它有一个从-60 ° F的温度范围内服务超过250 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP121提供的两个组成部分，加上灵活的治疗计划的一比一的比例混合的非关键应用方便，以最好地满足特定的加工要求。 硕士邦德聚合物系统EP121是提供在两个各有超过9个月的最低稳定液体成分时形成于大约75存放于温度+5 ° F. 它很容易准备的灌封或包封在一比一的比例混合非关键，通过简单的重量或体积的两个组分混合。 凝胶时间和固化时间取决于温度。 推荐的凝胶时间为1至11小时212-225 ° F。 完全固化，可达到加热凝胶EP121环氧树脂系统额外1-2个小时，在250 ° F。 在较高温度下固化后1-3小时，例如在300 ° F是可选​​的，其主要好处是在热变形温度提高。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.

硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂灌封和封装的电气结合高物理强度性能，卓越的热冲击和耐热性，惰性水和良好的电绝缘特性的化学品树脂体系。 它有一个从-60 ° F的温度范围内服务超过250 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP121提供的两个组成部分，加上灵活的治疗计划的一比一的比例混合的非关键应用方便，以最好地满足特定的加工要求。 硕士邦德聚合物系统EP121是提供在两个各有超过9个月的最低稳定液体成分时形成于大约75存放于温度+5 ° F. 它很容易准备的灌封或包封在一比一的比例混合非关键，通过简单的重量或体积的两个组分混合。 凝胶时间和固化时间取决于温度。 推荐的凝胶时间为1至11小时212-225 ° F。 完全固化，可达到加热凝胶EP121环氧树脂系统额外1-2个小时，在250 ° F。 在较高温度下固化后1-3小时，例如在300 ° F是可选​​的，其主要好处是在热变形温度提高。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.