EP21FL-1, Master Bond, Inc., Resins and Compounds
Type: Thermally cured ; Material System: ; Chemical System: Epoxy ; Filler: ; Form / Shape: Liquid ; Features & Industry / Applications: ; Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: -60 to 250 F; Deflection Temperature: 150 F; Thermal Conductivity: 0.8210 W/m-K; CTE: 33 to 44 µin/in-F; Mechanical: ; Tensile (Break): 2460 psi; Tensile Modulus: 260 ksi; Elongation: 54.0 %; Electrical: ; Resistivity: 1.00E13 ohm-cm; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 4.22 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption: 0.5000 to 2.00 %; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Master Bond Polymer System EP21FL-1 is a low viscosity, two component epoxy resin system for high…
EP21FL-1,硕士邦德公司,树脂和化合物,EP21FL-1, Master Bond, Inc., Resins and Compounds

EP21FL-1, Master Bond, Inc., Resins and Compounds
Type: Thermally cured ; Material System: ; Chemical System: Epoxy ; Filler: ; Form / Shape: Liquid ; Features & Industry / Applications: ; Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working ; Features: ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: -60 to 250 F; Deflection Temperature: 150 F; Thermal Conductivity: 0.8210 W/m-K; CTE: 33 to 44 µin/in-F; Mechanical: ; Tensile (Break): 2460 psi; Tensile Modulus: 260 ksi; Elongation: 54.0 %; Electrical: ; Resistivity: 1.00E13 ohm-cm; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 4.22 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption: 0.5000 to 2.00 %; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Master Bond Polymer System EP21FL-1 is a low viscosity, two component epoxy resin system for high…
EP21FL-1,硕士邦德公司,树脂和化合物,EP21FL-1, Master Bond, Inc., Resins and Compounds