硕士邦德聚合物系统EP19M是一种高性能的环氧树脂配方特殊配方,以保证金,以处理含氟聚合物及其他难以粘接的表面。 它是作为一种单组分化合物,低粘度要求在高温下固化,以获得高的粘结强度等基板。 该债券形成的耐用性能和维护自己的实力暴露在潮湿,高温等不利环境条件。 治疗可借加热到300至350 ° F约30至50分钟。
Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high bond strength to such substrates. The bonds formed are durable and maintain their strength properties when exposed to humidity, high temperatures and other unfavorable environmental conditions. Cure can be effected by heating to between 300 and 350°F for approximately 30 to 50 minutes.
| Type | CastingResin; Thermally cured |
| Material System | |
| Chemical System | Epoxy |
| Filler | Unfilled |
| Features & Industry / Applications | |
| Industry | Electronics; Electrical Power or High Voltage |
EP19M,硕士邦德公司,聚合物和塑料材料,EP19M, Master Bond, Inc., Polymers and Plastic Materials
EP19M
硕士邦德聚合物系统EP19M是一种高性能的环氧树脂配方特殊配方,以保证金,以处理含氟聚合物及其他难以粘接的表面。 它是作为一种单组分化合物,低粘度要求在高温下固化,以获得高的粘结强度等基板。 该债券形成的耐用性能和维护自己的实力暴露在潮湿,高温等不利环境条件。 治疗可借加热到300至350 ° F约30至50分钟。
Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high bond strength to such substrates. The bonds formed are durable and maintain their strength properties when exposed to humidity, high temperatures and other unfavorable environmental conditions. Cure can be effected by heating to between 300 and 350°F for approximately 30 to 50 minutes.
| Type | CastingResin; Thermally cured |
| Material System | |
| Chemical System | Epoxy |
| Filler | Unfilled |
| Features & Industry / Applications | |
| Industry | Electronics; Electrical Power or High Voltage |
EP19M,硕士邦德公司,聚合物和塑料材料,EP19M, Master Bond, Inc., Polymers and Plastic Materials
EP19M
硕士邦德聚合物系统EP19M是一种高性能的环氧树脂配方特殊配方,以保证金,以处理含氟聚合物及其他难以粘接的表面。 它是作为一种单组分化合物,低粘度要求在高温下固化,以获得高的粘结强度等基板。 该债券形成的耐用性能和维护自己的实力暴露在潮湿,高温等不利环境条件。 治疗可借加热到300至350 ° F约30至50分钟。
Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high bond strength to such substrates. The bonds formed are durable and maintain their strength properties when exposed to humidity, high temperatures and other unfavorable environmental conditions. Cure can be effected by heating to between 300 and 350°F for approximately 30 to 50 minutes.
| Type | CastingResin; Thermally cured |
| Material System | |
| Chemical System | Epoxy |
| Filler | Unfilled |
| Features & Industry / Applications | |
| Industry | Electronics; Electrical Power or High Voltage |
EP19M,硕士邦德公司,聚合物和塑料材料,EP19M, Master Bond, Inc., Polymers and Plastic Materials