硕士邦德聚合物系统EP21Q是一种二组分石英填充的环氧复合耐磨涂层,密封,粘接应用。 这是配方治愈室温或高温下更迅速,具有重量或体积一到一的比例混合。 它易于开发的室温比2900磅高的粘结强度。 硕士邦德聚合物系统EP21Q可应用于无下垂或垂直的表面上,甚至滴水。 它产生持久的高强度债券是显着的包括水,油和大多数有机溶剂耐化学品,在-60 ° F极宽的温度范围超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分晒黑。 硕士邦德EP21Q被广泛用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。
Master Bond Polymer System EP21Q is a two component quartz filled epoxy compound for abrasion resistant coatings, sealing and bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio by weight or volume. It readily develops a high bond strength of 2900 psi at room temperature ratio. Master Bond Polymer System EP21Q can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength bonds which are remarkably resistant chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21Q is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.
| Type | Coating |
| Cure / Setting Technology | Multicomponent |
| Substrate | Ceramic; Concrete; Glass; Metallic; Plastic; Wood |
| Coating Material | Epoxy; Resin |
| Performance | |
| Operating Temperature | -60 to 250 F |
| Resistivity | 1.00E12 ohm-cm |
| Dielectric Strength | 1.42E7 to 1.77E7 V/m |
| Form | Liquid |
| Features | Protective |
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