硕士邦德高分子胶粘剂EP21AN是双组分室温固化胶粘剂，密封剂和涂料，具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 它的重量或体积混合比为1:1格外宽容。 加速治愈的可能，增加热量。 作为导热胶将坚持多种承印物，可提供超过1700磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21AN提供了优越的抗，包括水，油，燃料，超过了-60℃的温度范围内的一些化学溶剂，广泛+250 ° F。 较低的粘度版本称为EP21ANLV也可用。 该系统的流动性使之成为优良的导热灌封料。

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.

硕士邦德高分子胶粘剂EP21AN是双组分室温固化胶粘剂，密封剂和涂料，具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 它的重量或体积混合比为1:1格外宽容。 加速治愈的可能，增加热量。 作为导热胶将坚持多种承印物，可提供超过1700磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21AN提供了优越的抗，包括水，油，燃料，超过了-60℃的温度范围内的一些化学溶剂，广泛+250 ° F。 较低的粘度版本称为EP21ANLV也可用。 该系统的流动性使之成为优良的导热灌封料。

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.

硕士邦德高分子胶粘剂EP21AN是双组分室温固化胶粘剂，密封剂和涂料，具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 它的重量或体积混合比为1:1格外宽容。 加速治愈的可能，增加热量。 作为导热胶将坚持多种承印物，可提供超过1700磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21AN提供了优越的抗，包括水，油，燃料，超过了-60℃的温度范围内的一些化学溶剂，广泛+250 ° F。 较低的粘度版本称为EP21ANLV也可用。 该系统的流动性使之成为优良的导热灌封料。

Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1700 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.