EP110

EP110 Master Bond, Inc.

硕士邦德EP110是一种无溶剂低粘度环氧树脂在室温下具有寿命长锅是专为浸渍和铸造作业设计的树脂体系。 随手在一个艰难的以优异的抗热震性和优良的电气绝缘性能强固体高温它治愈。 粘附到金属等基材是非常好的。 没有开裂或从金属EP110树脂固化在宽温度范围的分离。 树脂的固化EP110系统的物理和电气性能均优于典型的常温固化的环氧树脂化合物展出的。

Master Bond EP110 is a solventless low viscosity epoxy resin system with a long pot life at room temperature which is specifically designed for impregnation and casting operations. It cures readily at elevated temperatures to a tough strong solid with outstanding thermal shock resistance and excellent electrical insulation properties. Adhesion to metals and other substrates is excellent. There is no cracking or separation of cured EP110 resin from metal over a wide temperature range. Physical and electrical properties of the cured EP110 resin system are superior to those exhibited by typical room temperature cured epoxy resin compounds.

技术参数/Specifications

Material System
Chemical System Epoxy
Composition Unfilled
Cure / Technology Thermoset; Two Component  
Composition & Features
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP110,硕士债券公司,工业密封剂,EP110, Master Bond, Inc., Industrial Sealants

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EP110

EP110 Master Bond, Inc.

硕士邦德EP110是一种无溶剂低粘度环氧树脂在室温下具有寿命长锅是专为浸渍和铸造作业设计的树脂体系。 随手在一个艰难的以优异的抗热震性和优良的电气绝缘性能强固体高温它治愈。 粘附到金属等基材是非常好的。 没有开裂或从金属EP110树脂固化在宽温度范围的分离。 树脂的固化EP110系统的物理和电气性能均优于典型的常温固化的环氧树脂化合物展出的。

Master Bond EP110 is a solventless low viscosity epoxy resin system with a long pot life at room temperature which is specifically designed for impregnation and casting operations. It cures readily at elevated temperatures to a tough strong solid with outstanding thermal shock resistance and excellent electrical insulation properties. Adhesion to metals and other substrates is excellent. There is no cracking or separation of cured EP110 resin from metal over a wide temperature range. Physical and electrical properties of the cured EP110 resin system are superior to those exhibited by typical room temperature cured epoxy resin compounds.

技术参数/Specifications

Material System
Chemical System Epoxy
Composition Unfilled
Cure / Technology Thermoset; Two Component  
Composition & Features
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP110,硕士债券公司,工业密封剂,EP110, Master Bond, Inc., Industrial Sealants

Related posts

EP110

EP110 Master Bond, Inc.

硕士邦德EP110是一种无溶剂低粘度环氧树脂在室温下具有寿命长锅是专为浸渍和铸造作业设计的树脂体系。 随手在一个艰难的以优异的抗热震性和优良的电气绝缘性能强固体高温它治愈。 粘附到金属等基材是非常好的。 没有开裂或从金属EP110树脂固化在宽温度范围的分离。 树脂的固化EP110系统的物理和电气性能均优于典型的常温固化的环氧树脂化合物展出的。

Master Bond EP110 is a solventless low viscosity epoxy resin system with a long pot life at room temperature which is specifically designed for impregnation and casting operations. It cures readily at elevated temperatures to a tough strong solid with outstanding thermal shock resistance and excellent electrical insulation properties. Adhesion to metals and other substrates is excellent. There is no cracking or separation of cured EP110 resin from metal over a wide temperature range. Physical and electrical properties of the cured EP110 resin system are superior to those exhibited by typical room temperature cured epoxy resin compounds.

技术参数/Specifications

Material System
Chemical System Epoxy
Composition Unfilled
Cure / Technology Thermoset; Two Component  
Composition & Features
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP110,硕士债券公司,工业密封剂,EP110, Master Bond, Inc., Industrial Sealants

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