硕士邦德聚合物系统EP21DP11是一种低粘度双组份高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，制定了在室温条件下或在高温下更迅速地治愈了一个方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的的空气释放剂。 硕士邦德聚合物系统EP21DF11特别是必要的，建议低粘度固化涂料或铸件必须承受恶劣的环境下，也接触到各种化学品和温度循环可达275 ° F。 相似和不同基材的粘合性非常出色。 硬化材料是电绝缘体。 部分的颜色，一个是红色的; B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛应用于电子，电气，计算机，建筑，家电，汽车，金属加工，化工等行业。 该化合物符合MIL – I 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.

硕士邦德聚合物系统EP21DP11是一种低粘度双组份高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，制定了在室温条件下或在高温下更迅速地治愈了一个方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的的空气释放剂。 硕士邦德聚合物系统EP21DF11特别是必要的，建议低粘度固化涂料或铸件必须承受恶劣的环境下，也接触到各种化学品和温度循环可达275 ° F。 相似和不同基材的粘合性非常出色。 硬化材料是电绝缘体。 部分的颜色，一个是红色的; B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛应用于电子，电气，计算机，建筑，家电，汽车，金属加工，化工等行业。 该化合物符合MIL – I 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.

硕士邦德聚合物系统EP21DP11是一种低粘度双组份高性能阻燃环氧化合物，耐化学腐蚀铸造，涂料，灌封应用，制定了在室温条件下或在高温下更迅速地治愈了一个方便的两（2）一（1）混合比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 它含有一种特殊的的空气释放剂。 硕士邦德聚合物系统EP21DF11特别是必要的，建议低粘度固化涂料或铸件必须承受恶劣的环境下，也接触到各种化学品和温度循环可达275 ° F。 相似和不同基材的粘合性非常出色。 硬化材料是电绝缘体。 部分的颜色，一个是红色的; B部分是清晰的棕褐色。 硕士邦德聚合物系统EP21DP11被广泛应用于电子，电气，计算机，建筑，家电，汽车，金属加工，化工等行业。 该化合物符合MIL – I 46O58C要求。

Master Bond Polymer System EP21DP11 is a low viscosity, two component flame retardant epoxy compound for high performance, chemical resistant casting, coating, and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This compound is 100% reactive and does not contain any solvents or other volatiles. It contains a special air release agent. Master Bond Polymer System EP21DF11 is particularly recommended where a low viscosity is required and cured coatings or castings must withstand severe environmental conditions and also exposure to various chemicals and temperature cycling up to 275°F. Adhesion to both similar and dissimilar substrates is excellent. The hardened material is an electrical insulator. Color of part A is red; part B is clear tan. Master Bond Polymer System EP21DP11 is widely used in the electronic, electrical, computer, construction, appliance, metal working, automotive and chemical industries. The compound meets MIL-I-46O58C requirements.