EP110

硕士邦德EP110是一种无溶剂型低粘度环氧树脂在室温下长锅的生活，这是专门为浸渍和铸造业务设计的树脂体系。 它很容易在一个艰难的以优异的抗热震性和优良的电气绝缘性能强固体高温固化。 金属等基材的粘合性非常出色。 有治愈金属EP110树脂在宽广的温度范围内不开裂或分离。 EP110固化后的树脂体系的物理和电气性能均优于典型的常温固化环氧树脂化合物展出。

Master Bond EP110 is a solventless low viscosity epoxy resin system with a long pot life at room temperature which is specifically designed for impregnation and casting operations. It cures readily at elevated temperatures to a tough strong solid with outstanding thermal shock resistance and excellent electrical insulation properties. Adhesion to metals and other substrates is excellent. There is no cracking or separation of cured EP110 resin from metal over a wide temperature range. Physical and electrical properties of the cured EP110 resin system are superior to those exhibited by typical room temperature cured epoxy resin compounds.