EP21TPFL-1, Master Bond, Inc., Epoxy Adhesives
Cure / Technology: Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Features: High Dielectric ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 2500 to ? cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -80 to 250 F; Thermal Conductivity (W/m-K): ; CTE: 22 µin/in-F; Mechanical: ; Tensile (Break): 1700 to ? psi; Elongation: 80.0 to ? %; Electrical & Optical: ; Dielectric Strength: 420 to ? kV/in; Dielectric Constant: 3.80 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric…
EP21TPFL-1,硕士德公司,环氧粘剂,EP21TPFL-1, Master Bond, Inc., Epoxy Adhesives