UV10FLTK-1, Master Bond, Inc., Industrial Sealants
Material System: ; Chemical System: ; Composition: ; Cure / Technology: UV or Radiation Cured; Single Component ; Type / Form: Liquid ; Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates ; Composition & Features: ; Features: High Dielectric; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation ; Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity: 100000 to ? cP; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity: ? to 0.0290 W/m-K; CTE: 44 to 50 µin/in-F; Mechanical: ; Tensile (Break): 1800 psi; Elongation: 100.0 to ? %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant: 3.52 to ? ; Optical: ; Index of Refraction: 1.56 ; Transmission: 95.00 to ? %; Notes: Master Bond UV10FL-1 and UV10FLTK-1 are a one component UV curable modified compounds, ready for use…
UV10FLTK-1,硕士德公司,工业密封剂,UV10FLTK-1, Master Bond, Inc., Industrial Sealants