EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: High Dielectric ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE: 12 µin/in-F; Mechanical: ; Tensile (Break): 2500 to 9400 psi; Elongation: ? to 3.0 %; Electrical & Optical: ; Dielectric Strength: 400 to ? kV/in; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP30DPF-1 is a new versatile two component epoxy/urethane elastomer…
EP21LVLP,硕士德公司,氨粘剂及密封剂,EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: High Dielectric ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE: 12 µin/in-F; Mechanical: ; Tensile (Break): 2500 to 9400 psi; Elongation: ? to 3.0 %; Electrical & Optical: ; Dielectric Strength: 400 to ? kV/in; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP30DPF-1 is a new versatile two component epoxy/urethane elastomer…
EP21LVLP,硕士德公司,氨粘剂及密封剂,EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants
Compound Type: Adhesive ; Type / Form: Liquid ; Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates ; Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component ; Features: High Dielectric ; Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE: 12 µin/in-F; Mechanical: ; Tensile (Break): 2500 to 9400 psi; Elongation: ? to 3.0 %; Electrical & Optical: ; Dielectric Strength: 400 to ? kV/in; Dielectric Constant (): ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP30DPF-1 is a new versatile two component epoxy/urethane elastomer…
EP21LVLP,硕士德公司,氨粘剂及密封剂,EP21LVLP, Master Bond, Inc., Polyurethane Adhesives and Sealants